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NAND Product Engineer Intern Folsom, CA, US Jul 19, 2018
Campus_2019届_SSD Validation Engineer(实习生) shanghai, 31, CN Jun 23, 2018
Campus_ SSD Firmware Testing Engineer (intern) shanghai, 31, CN Jul 19, 2018
Campus_ 2019届_ SSD Firmware Testing Engineer (实习生) shanghai, 31, CN Jul 16, 2018
Campus__SSD Firmware Engineer(intern) shanghai, 31, CN Jul 4, 2018
Campus_2019届_IC Design Verification Engineer (实习生) shanghai, 31, CN Jun 22, 2018
Intern, SSD Firmware Engineer shanghai, 31, CN Jul 19, 2018
R&D Wet Process Development Engineer Boise, ID, US Jul 2, 2018
Senior Engineer - Non-Volatile Managed NAND Product Engineering Boise, ID, US Jul 4, 2018
Technology Development Data Engineer Intern Boise, ID, US Jun 29, 2018
Technology Development User Interface Developer Intern Boise, ID, US Jun 29, 2018
eMMC Firmware Engineer(Intern) Shanghai, 31, CN Jul 18, 2018
Technology Development Data Scientist Intern Boise, ID, US Jun 29, 2018
Flash Process Integration Intern Manassas, VA, US Jul 17, 2018
Package Design Engineer Taichung City, TXG, TW Jul 10, 2018
Analog Design Engineer Minneapolis, MN, US Jul 10, 2018
Senior ASIC Design Engineer Minneapolis, MN, US Jun 30, 2018
Senior ASIC Design Engineer Shanghai, 31, CN Jun 23, 2018
Senior ASIC Design Engineer Shanghai, 31, CN Jul 13, 2018
ASIC Design Engineer Shanghai, 31, CN Jun 23, 2018
Module Development Engineer Boise, ID, US Jun 26, 2018
Design Verification Engineer Milpitas, CA, US Jun 25, 2018
MXA NPI Technical Engineer Xi'an, 61, CN Jun 21, 2018
ASIC Physical Design Engineer Minneapolis, MN, US Jul 1, 2018
Principal Analog Design Engineer Minneapolis, MN, US Jun 26, 2018
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