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Engineer, Process Integration (Entry Level)

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Date: May 29, 2019

Location: Taichung, TXQ, TW

Company: Micron


Req. ID: 125059 

As an Integration Engineer in Micron's Advanced Packaging Technology Development Group, you will be responsible for driving leading edge Technode development. You will  collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is shown through meeting the requirements for thermal, mechanical, electrical, reliability and customer specifications.  You will drive the technology development through multiple phases of maturity and contribute to Micron's strategic objectives of Technology leadership.


Key Responsibilities:

  • Understand the roadmap for silicon and package technology for different market segments and work to identify solutions to meet business needs.
  • Develop and execute the plan to integrate new silicon technology with new package technologies for various memory applications to address Chip Package Interaction (CPI) issues.
  • Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
  • Work with silicon, package and saw street designers to find solutions and implement relevant design rules.
  • Collaborate with worldwide R&D/manufacturing wafer fabs and packaging teams to solve relevant issues and improve yield, quality and manufacturability.


  • Qualifications:

  • Recent graduate from top university in technical engineering fields
  • Strong interpersonal, oral and written English communications-skills
  • Availability to get on board within 3 months 


  • Education:

    • M.S. in  Electrical Engineering, Microelectronics, Physics, or Material Science Engineering, PhD preferred Or Equivalent work experience


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung (TW-TXQ) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

Job Segment: Electronics Engineer, Process Engineer, Thermal Engineering, Package Design, Engineering, Manufacturing, Entry Level