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Sr. Director, Advance Package Technology Dvelopment

Taichung, TXG, TW

 

Req. ID: 138231 

Micron in Taiwan

Micron's global footprint is designed to deliver comprehensive customer teamwork, support and quality around the world and throughout the product lifecycle.

Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM.

Lead a team of technology development (TD) engineers to develop the next generation 3D stacking package technology.

Provide general packaging leadership and strategy to influence the company's technical direction.

Represent TD and work effectively to produce cross department cooperation

Budget responsibility, including: Capital, Expense, and Head Count

Report directly to VP of advanced packaging technology development (APTD)

Provide technical mentoring and leadership development for advanced packaging team members.

Lead by example to generate a vibrant, ambitious work environment, with a sense of urgency.

Provide site leadership in advanced packaging and integration into manufacturing.

Establish and prioritize TD projects that support Micron objectives and enhance Micron products.

Continuously strive to improve the R&D group performance and efficiency.

Responsible for department interfacing, related to TD advanced packaging.

Work closely with university leaders to provide Micron with access to highest caliber students.

Hire effectively to build and maintain a world-class TD team.

Understand the impact and implications of TD strategy to the overall company strategy and directions.

Help to provide a safe and clean work environment.

Travel to USA, Japan, and Singapore required

Capabilities, Education, and Experience:

Strong project management skills Strong people management and interpersonal skills.

Fluent in English as a second language or greater deep understanding of business and culture in Taiwan.

10+ years of experience in semiconductor engineering process.

5+ years of management experience in semiconductor package development

3+ years of budget management over $5M/yr

Experience and technical knowledge with 3D stacking and wafer level packaging Advanced degree (MS or PhD) in Engineering is required.

 

According to the "Employment Service Act", any position with salary lower than NTD$40,000, please refer to the salary information in the job description.

Positions with a salary over NTD$40,000 may not be mentioned in the job description and will be discussed in interview.

We are an equal opportunity employer and value diversity at our company.

We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan, China (TW) || Backend Manufacturing || Experienced || Regular || Manufacturing/Production Operations || #LI-CC1 ||
 

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