Share this Job

ENGINEER, PACKAGE CHARACTERIZATION

Date: May 12, 2019

Location: Taichung, TXG, TW

Company: Micron

 

Req. ID: 131239 

As a Sr. Characterization Engineer you will be responsible for global coordination of mechanical testing of materials & packages to support DRAM and NAND packaging development efforts.  You will develop and document test methods as needed to characterize materials, processes, and semiconductor packages to globally support Materials Engineering, Simulation Engineering, Process Development Engineering, Process Engineering, QRA Engineering, and Supplier Quality Engineering teams. You will review and summarize data to provide recommendations to these teams.  You will develop and enable new mechanical characterization methods for advanced materials and package technology concepts that are capable of enabling global site requirements. You will provide recommendations for test structure and test vehicle design.  Close collaboration with multiple engineering teams in Close collaboration with multiple engineering teams in development, process integration, design, assembly, product engineering, and quality is required. 

 

Responsibilities:

  • Provide metrology equipment recommendations (TOR) to support development of new test methods for characterizing materials and memory packages
  • Participate in the metrology key equipment group process to fan-out new tools & methods to the assembly network
  • Lead global development of new test methods as needed, e.g. package strength test method for mobile DRAM PoP packages, performing MSA and getting processes to an acceptable maturity level that can be transferred to assembly production sites
  • Coordinate testing and data analysis as needed for materials, process, and package development efforts with responsibility for test methods such as TMA, DMA, DIC, TSM, compression, tensile, flexural, cantilever beam, 3pt/4pt bend, ring-on-ring, etc.
  • Establish data collection and statistical data analysis methods for all tests, providing summary reports with recommendations
  • Coordinate measure system analysis studies for each test method as needed to insure measurement methods are capable
  • APTD global point of contact for coordinating additional testing with corporate labs when needed for analysis methods such as nano-indentation, DSC, TGA, and AFM
  • APTD global point of contact for selecting external labs for any additional testing needs and coordinating analytical work performed
  • Define characterization plans for new packaging technologies taking into account chip-package-interaction (CPI) effects
  • Drive useful life modeling of failure mechanisms in the expected application environments based on known acceleration model algorithms and experimentally derive physical constants as needed for primary material related wear-out failure mechanisms
  • Participate in technology risk assessments for new packages and packaging technologies and provide recommendations to mitigate risk profile
  • Assist in resolve packaging material related qualification and production issues

 

Successful candidates must have:

  • Detailed understanding of test methods & equipment used to characterize polymer materials, metals, alloys, and ceramics
  • Experience with multiple analysis techniques such as SEM/EDS, SEM/EBSD, FIB, TEM
  • Excellent problem solving and analytical skills
  • Strong data analysis, SPC, DOE, MSA skills
  • Knowledge of material related failure mechanisms, chip-package interactions, reliability testing, and reliability modeling is preferred
  •  

Degree required:

  • MS or equivalent

 

Academic Discipline(s):

  • Materials Engineering, Metallurgical Engineering, Chemical Engineering or related discipline

 

Experience Required:

5 years minimum experience, >10 years preferred


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || College || Regular || Engineering || Not Applicable ||
 


Job Segment: Package Design, Semiconductor, Materials Science, Metallurgy, Manufacturing, Science