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Taichung, TXG, TW


Req. ID: 144349 

Specific Responsibilities: 

  • Advanced package technology (chip stacking, 2.5D or 3D) research and development
  • Familiar with wafer support system(carrier bonding & de-bonding for thin wafer handling)
  • Familiar with NCP/NCF process
  • Familiar with thin wafer dicing 
  • Familiar with JMP data analysis and DOE matrix design
  • Process problem identification and solving
  • Work effectively to produce cross sections cooperation


  • MS or Ph.D. with an engineering major
  • 3 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred
  • Innovative with independent thinking
  • Good team player with a high motivation
  • Fluent communication in in both English and Chinese


According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan, China (TW) || Technology Development || Experienced || Regular || Engineering || #LI-CY1 ||

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