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Taichung, TXQ, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 


Req. ID: 263622 


As an Integration Engineer in Micron's Package Development Engineering (PDE) Group, you will be responsible for driving leading edge Technode development. You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is shown through meeting the requirements for thermal, mechanical, electrical, reliability and customer specifications.  You will drive the technology development through multiple phases of maturity and contribute to Micron's strategic objectives of Technology leadership.


Key Responsibilities:

  • Understand the roadmap for silicon and package technology for different market segments and work to identify solutions to meet business needs.
  • Develop and execute the plan to integrate new silicon technology with new package technologies for various memory applications to address Chip Package Interaction (CPI) issues.
  • Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
  • Work with silicon, package and saw street designers to find solutions and implement relevant design rules.
  • Collaborate with worldwide R&D/manufacturing wafer fabs and packaging teams to solve relevant issues and improve yield, quality and manufacturability.


  • Qualifications:

  • Recent graduate from top university in technical engineering fields
  • Strong interpersonal, oral and written English communications-skills
  • Availability to get on board within 3 months 


  • Education:

    • M.S. in  Electrical Engineering, Microelectronics, Physics, or Material Science Engineering, PhD preferred Or Equivalent work experience


About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit


According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.


Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Taichung || Taichung (TW-TXQ) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || #LI-EH1 || Tier 3 || 

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