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SR ENGINEER, PACKAGING DEVELOPMENT ENGINEERING

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 260147 

 

Execute the NPI Business Process

  • MUF BGA and LPDDR PoP-t Packaging Development for DRAM and ASIC productions.
  • To develop strip design for MTB. (Micron Taichung Backend) with validation plan.
  • To design the best structure/BOM with packaging mechanical simulation and DOE plan.
  • Develop packaging NPI in MTB and OSAT sites, qualify the devices, and ramp up the volume and then step into mass production with phase gate review.
  • Packaging technology benchmarking and development.
  • Take Product E2E Responsibility and solve the critical issues factory escalates or customer returns.
  •  Ensure flawless ramp up from NPI to HVM Analyze yield , process and semiconductor test data , isolate root cause of yield loss and product performance degradation.

 

REQUIREMENTS:

  • Masters or Bachelor’s degree in Engineering or equivalent work experience
  • At least 10 years of related experience
  • Experience in Assembly Process Engineering or Package Development preferred with good technical knowledge is manufacturing process.
  • Demonstrated track record of strong project management and problem-solving skills
  • Excellent data analysis, statistical analysis, data interpretation skills
  • Proven ability to make sound data-driven decisions.  Organize and apply due-diligence in day to day task.
  • Proficiency in Excel, Word, Power Point, Project Management Software or any equivalent software.
  • With good oral and written English communication skill

 

GJS: E5

 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers

 

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.

 

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

 

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-EH1; Not Applicable || Tier 4 || 

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