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SR ENGINEER, PACKAGE MATERIALS

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 240502 

 

Micron PDE Package Materials Engineer

Job Description

As a PDE Senior Package Materials Engineer (Pathfinding) you will be primarily responsible for defining, planning, and characterize new packaging materials requirements for advance packaging such as cryogenic applications, advance SER mitigated packaging  in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, and some materials analysis methodology. Additional responsibilities include coordinating and carrying out lab sourcing and material evaluation/optimization to assess reliability risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities

  • Lead the discussion with packaging material suppliers in meeting Micron materials technical specification and roadmaps
  • Be proactive and take initiative in new packaging materials pathfinding works and explorations
  • Own and establish overall package characterization planning and execution for advance packaging requirements such as sequential reliability testing, cryogenic application and High-Performance Computing requirements
  • Collaborate with PDE-PIE/ TD and GQ on materials and package characterization
  • Be the lead in driving resolution of issues encountered during package characterization
  • Execute package characterization tracking and forecasting for new package NPIs, post reliability survivor analysis
  • Be the Point-of Contact pertaining to all aspects of assigned products/packages,
  • Develop strategies to drive materials and package with regards to materials improvement

 Requirements

  • PhD in Electronics/ Electrical/ Chemical/ Materials Engineering
  • Highly motivated individuals with 3 ~ 5 years working experience are encouraged to apply
  • Familiar and well-versed in package and/or materials characterization techniques such as TMA/ DSC/ TGA/ warpage analysis tool/ CSAM/ ball bond shear and/or pull testing
  • Well-versed in semiconductor packaging process and materials interaction
  • Good understanding of semiconductor reliability stress testing and material science
  • A team player equipped with excellent interpersonal and communication skills.
  • Possess initiative and ability to work independently.
  • Good semiconductor failure mechanism and materials analysis skills
  • With good oral and written English communication skill

 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers

 

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.

 

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

 

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || Not Applicable || Tier 4 || 

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