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SR ENGINEER, PACKAGE CHARACTERIZATION

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 240461 

 

Micron PDE Package Characterization Engineer

Job Description

As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterizing new packages, new packaing materials in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, and some materials analysis methodology. Additional responsibilities include co-ordinating and carrying out lab sourcing and material evaluation/optimization to assess reliability risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization and liaising with material suppliers to achieve quality, cost and risk management objectives.

 

Responsibilities

  • Lead the discussion with packaging material suppliers in meeting Micron materials specification and roadmaps
  • Own and establish overall package mechanical characterization planning and execution
  • Collaborate with FAE/ SQE/ PDE-PIE/ TD and GQ on materials and mechanical characterization
  • Be the lead in driving resolution of issues encountered during package characterization
  • Execute package mechanical characterization tracking and forecasting for new package NPIs, post reliability survivor analysis
  • Be the Point-of Contact pertaining to all aspects of assigned products/packages
  • Develop strategies to drive materials and package with regards to materials improvement from mechanical perspective

 

Requirements

  • 3~ 5 years semiconductor packaging experience is preferred
  • MS above in Mechanical/ Mechatronics/ Materials Engineering
  • Highly motivated individuals with relevant working experience are encouraged to apply.
  • Familiar and well-versed in package and/or materials characterization techniques such as mechanical drop test/ warpage analysis/ 3 Point Bending/ 4 Point Bending Test/ ball bond shear and/or pull testing
  • Well-versed in semiconductor packaging process and materials interaction
  • Good understanding of package and/or system level mechanical testing and material science
  • A team player equipped with excellent interpersonal and communication skills.
  • Possess initiative and ability to work independently.
  • Good semiconductor package strength analysis and materials analysis skills
  • With good oral and written English communication skill

 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers

 

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.

 

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

 

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || Not Applicable || Tier 4 || 

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