Share this Job
Apply now »

Process Integration Engineer

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 278689 

 

ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT- Process Integration Engineer

Location: Taichung city, Taiwan

Job Description

The Advanced Packaging Technology Development group supports Micron with packaging solutions for wafer and die level forms. As a Process Integration Engineer in the Advanced Packaging Technology Development department, your primary responsibility will be the process development for HBM (high bandwidth memory). You will be expected to work with cross-functional teams to define and develop new 3DI TSV packaging processes that enable next generation 3DI packaging technology to be transferred to manufacturing. You will also be responsible for sustaining and making the improvement efforts to yield and equipment performance to achieve high device yield, reliability, and cost efficiency.

Your responsibilities will include, but are not limited to the following:

  • Establish and improve process condition and technology for advanced processes
  • Establish and modify process management projects
  • Abnormal analysis and improvement
  • Work effectively to produce cross sections cooperation

You have the following Qualifications:

  • Display a positive attitude toward Micron and its policies
  • Excellent multi-tasking, time-management, organization and prioritization skills
  • Establish and maintain effective relationships
  • Ability to plan, drive and complete projects effectively
  • Strong written and verbal communication skills
  • Detailed oriented and able to follow complex procedures
  • Continuously learn and self-improve
  • Organize and expertly facilitate meetings and project teams
  • Analytical problem-solving skill

Education and Experience:

  • MS/PhD with an engineering major
  • 3 year or above experience in semiconductor process, assembly process, or substrate process technologies is preferred
  • Experience with process integration engineering background is preferable
  • Fluent communication in both English and Chinese

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high- performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers


This Notice is being provided as a result of the filing of an application for permanent alien labor certification for this job opportunity.  Any person may provide documentary evidence bearing on the application to:


Certifying Officer
U.S. Department of Labor
Employment and Training Administration
Harris Tower
233 Peachtree Street, Suite 410
Atlanta, Georgia 30303
 

Upload your resume and immediately see jobs for you!


Job Segment: Process Engineer, Semiconductor, Engineer, Manufacturing Engineer, Data Center, Engineering, Science, Technology

Apply now »