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PDE SR. TD Engineer

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 


Req. ID: 272932 


  • Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are every day responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An important topic is the ChIp package interactions : Deep fundamental understanding of the key risks of CPI in Wirebond and Flip chip technologies is needed. Actual experience with CPI is a plus. Finally the hands on equipment experience in Pkg Assembly process is needed,  to understand the requirements for new equipment to the supplier, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.
  • Familiar as process of Die attach and wire bonding process are better.
  • Experience needed: Min 3 years – 15 years max
  • Education level: PhD and MSc preferred, however, all experienced candidates will be seriously considered
  • GJS Range: E2-E4


About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.


Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-EH1 || Tier 4 || 

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