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PDE SENIOR/ENGINEER - PIE PWF HBM

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 252461 

 

Job description:

As PWF HBM PIE (package integration engineering) Engineer, in close collaboration with Multi-functional Groups ( BU, APTD, DESIGN, Site Engineering, Central Team, KEG) , is responsible for the effective and efficient execution of new product and integration from NPN (new product notification) to high volume manufacturing. The success of this position will be assessed by the timely BU project timeline readiness for DC/ES/QS/Stick build, first time & on time package Qual release and the ability to ramp the product to minimum, predefined yield and quality targets from NPI-LVM and meeting 100% of handover criteria.

Key responsibilities and task

  • Drive the introduction of the new product through the Advance Package Qualification Process (APQP).
  • Work closely with different teams to ensure seamless transition into HVM within the stipulated time and meeting minimum yield & quality expectations. Manage new product by management and NPI execution by assessing the QUAL, LVM result and status by mean of NPI Checklist & phase gate meeting.
  • Create NPI plan to collect, analyze input and communicate Process of Record, TRA, PDSS and other relevant documents for each new product. Develop, validate and document the configuration requirement, baseline plan and/or model in relation to MOR (Model of Record), POR (Plan or Process of Record), TOR (Tool of Record) and BOM (Bill of Materials) for the new or transferred products and packages, to support the effort to create commonality and one recipe across all sites.
  • Collaborate with development and module groups (ex: APTD, NPI, DESIGN, KEG) to enable on-time qualification of new product/packaging solution, thru the definition of package multi-functional design review with initial feasibility study and review, leading to Final package stackup/process flow/BOM/TRA.
  • Develop strategic solutions and roadmaps through collaboration with internal and external stakeholders. Provide leadership in problem analysis and resolution at network level. Work with groups outside of your department to identify and close technical gaps related to new product integration.
  • Be the domain specialist of the NPI business process and system and develop strategies to drive continuous improvement. Provide rigorous documentation for all aspects of product development from design, direct materials, process parameters, equipment and PML validation.
  • Support Build fulfilment with Customer Samples, Engineering Samples, Quality Samples or other Controlled Engineering builds for new products/packages.
  • Take Product E2E Responsibility and solve the critical issues factory escalates or customer returns.
  • Ensure flawless ramp up from NPI to HVM Analyze yield , process and semiconductor test data , isolate root cause of yield loss and product performance degradation.
  • Technology benchmarking and development

Requirements

  • Masters or Bachelor's degree in an Engineering
  • Experience in Fab Process, PWF or Backend engineering process or package development preferred
  • Experience in Python, Scripting is added points 
  • Good technical knowledge in component test and/or module manufacturing process
  • Excellent data analysis, statistical analysis, data interpretation skills
  • Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.
  • Proficiency in Excel, Word, Power Point, Project Management Software or any equivalent software.
  • With good oral and written English communication skills

 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.

 

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

 

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-EH1 || Tier 4 || 

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