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Date: Jun 4, 2019

Location: Taichung, TXQ, TW

Company: Micron


Req. ID: 125078 

As a Package Silicon Integration Manager in Micron's Advanced Packaging Technology Development Group, you will be responsible for driving leading edge IC package development. You will  collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is shown through meeting the requirements for thermal, mechanical, electrical, reliability and customer specifications.  You will drive the technology development through multiple phases of maturity and contribute to Micron's strategic objectives of Technology leadership.


Key Responsibilities:

  • Manage a team of engineers and foster a vibrant and energetic work environment with a sense of urgency.
  • Develop and execute the plan to integrate new silicon technology with new package technologies for various memory applications to address Chip Package Interaction (CPI) issues.
  • Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
  • Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues and improve yield, quality and manufacturability and complete technical risk assessment.
  • Work with stakeholders to understand and roadmap package technology requirements for future silicon by customer and by market segment. Identify technology, quality and business process gaps and develop and deploy needed solutions.
  • Be the contact window to the Si design and wafer fab regarding the progress of key projects.




  • Minimum of 10 years’ experience in R&D/manufacturing wafer fab or IC Package development
  • Fab process integration and cross-functional project management experience highly preferred.
  • Strong interpersonal, oral and written English communications-skills
  • Experience with Silicon integration and Design integration and mobile packaging is a plus.
  • Strong data analysis and DOE skills
  • Excellent problem solving and analytical skills



    • M.S. in - Electrical, Materials, Mechanical, Metallurgy, Physics or Chemistry, PhD preferred Or Equivalent work experience

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung || Taichung (TW-TXQ) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

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