Share this Job
Apply now »


Taichung, TXG, TW


Req. ID: 274041 



Micron in Taiwan

Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM.

Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles.


Micron PDE Package Characterization Engineer

Job Description

As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterize new packages in order to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, and some materials analysis methodology. Additional responsibilities include co-ordinating and carrying out lab sourcing and material evaluation/optimization to assess reliability risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization and liaising with material suppliers to achieve quality, cost and risk management objectives.



  • Collaborate with packaging material suppliers in meeting Micron materials specification and roadmaps
  • Own overall package characterization planning and execution
  • Collaborate with PDE-PIE/ CEM and GQ on materials and package characterization
  • Take the lead in driving resolution of issues encountered during package characterization
  • Package characterization tracking and forecasting for new package NPIs, post reliability survivor analysis
  • Be the Point-of Contact pertaining to all aspects of assigned products/packages,
  • Develop strategies to drive materials improvement



  • MS above in Electronics/ Electrical/ Chemical/ Materials Engineering
  • Highly motivated individuals with relevant working experience are encouraged to apply.
  • Familiar with materials characterization techniques such as TMA/ DSC/ TGA/ warpage analysis tool/ CSAM/ ball bond shear and/or pull testing
  • Well-versed in semiconductor packaging process and materials interaction
  • Basic understanding of semiconductor reliability stress testing and material science
  • A team player equipped with excellent interpersonal and communication skills.
  • Possess initiative and ability to work independently.
  • Good semiconductor failure analysis and materials analysis skills
  • Good English skill in both oral and written

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.


About Us

As the leader in creative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to use the value of data to unlock financial insights, accelerate scientific breakthroughs and improve communication around the world.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-EH1 || Tier 3 || 

Upload your resume and immediately see jobs for you!

Job Segment: Package Design, Semiconductor, Manufacturing Engineer, Electronics Engineer, Electrical, Manufacturing, Science, Engineering

Apply now »