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Date: Aug 20, 2019

Location: Taichung City, TXG, TW

Company: Micron


Req. ID: 120105 

Micron Package Design Engineer

Job Description


As a Package Design Engineer at Micron Technology, Inc., you will complete substrate and package designs to support New Product Introduction (NPI). You will be responsible for facilitating package design review meetings with the Taiwan assembly Development, NPI, and MFG teams. You will provide local support for site specific drawings and substrate vendor approval. You will gather site input to support a technical risk assessment process that occurs during feasibility and design stages. You will participate in a cross functional DFMEA meeting that reviews and ranks all package risks at design close. You will also work with global design team to make required design rule updates to lower risk levels based on manufacturing data and capabilities. 


Primary Responsibilities and Tasks


Create Package Designs

  • Create package and strip drawing
  • Create substrate drawing and wire bond diagram
  • Execute substrate supplier review and approval process
  • Document all design activity in design tracker/database


Facilitate package design reviews

  • Explain package design procedures and documentation as needed
  • Review package construction, substrate design, and required manufacturing steps
  • Highlight aggressive design rules
  • Facilitate an in-depth discussion to highlight potential risks
  • Ensure all known design, materials, and manufacturing risks are documented


Design Coordination and Management

  • Support package technology development activities.
  • Provide design support for thermal/mechanical/electrical simulation analysis.
  • Support the design group’s continuous improvement efforts.
  • Support global design alignment activities.
  • Contribute to package roadmaps.
  • Contribute to the Competitive Analysis review process
  • Contribute to package design rule and system development.





Bachelor Degree or equivalent experience

  • Mechanical / Electrical Engineering
  • Manufacturing / Industrial Engineer
  • Quality Systems Engineer
  • Materials Engineer


Desired Experience

  • At least 3 years of experience in the following:
  • Semi-conductor package design/development/manufacturing experience
  • Cadence Allegro (APD) or System in Package (SiP) software proficiency
  • AutoCAD 2D proficiency



  • Proficient in speaking and writing English and Taiwanese
  • Ability to lead collaborative efforts through cross-functional teams
  • Strong organizational and leadership skills
  • Proficient computer skills



  • International travel may be required on a quarterly basis for training/global alignment
  • Work environment will be office (cubical)
  • Shift will be 8+ hour shift, 5 days per week, Days


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Taichung City || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || #LI-RL1 ||

Job Segment: Package Design, Manufacturing Engineer, Engineer, Electrical, Construction, Manufacturing, Engineering