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Advanced Packaging Integration Sr. Manager

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 


Req. ID: 150664 


Job Description

As Advanced Packaging Process Integration Manager, you will be expected to lead a team of engineers to define and develop new 3DI TSV packaging processes that enable next generation 3DI packaging technology to be transferred to manufacturing supporting best in class new product enablement.


Responsibilities and Tasks

  • Work effectively to produce cross department cooperation and cross organization collaboration
  • Work with leadership to develop and maintain process roadmaps
  • Provide technical mentoring and leadership development for advanced packaging team members
  • Lead by example to generate a vibrant, energetic work environment, with a sense of urgency
  • Continuously strive to improve the Advanced Package Technology Development group performance and efficiency
  • Hire effectively to build and maintain a world class Advanced Packaging Development team
  • Promote and foster the Micron values
  • Help to provide a safe and clean work environment



  • Strong project management skills
  • Strong people management and communication skills
  • Fluent in English as a second language or greater
  • Deep understanding of business and culture in Taiwan
  • 12+ years of semiconductor and package experience
  • 8+ years of management experience in semiconductor package development
  • Experience and technical knowledge with 3D stacking and wafer level packaging
  • Advanced degree (MS or PhD) in Engineering required


About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit


According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.


Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || #LI-CC1 || Tier 5 || 

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