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Advanced Package Technology Developing Manager

Taichung, TXG, TW

 

Req. ID: 144352

 

Micron in Taiwan

Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM.

Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles.

As Advanced Package Technology Developing Manager, you will be responsible for building and leading a team of engineers to develop advanced packaging process and equipment solutions for TSV Memory products at Micron’s new Taiwan manufacturing assembly site (MTB); you will need to have a deep understanding of packaging requirements, process capability, current state of equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process; including but not limited to wafer level package process.

 

Provide process packaging solutions on time to meet company and customer needs

Work with cross-functional Global teams to roadmap future capabilities needed for packaging solutions

Engage across a broad group of internal and external customers on Package Development, Performance and Qualification requirements, as well as Test Chip and Product Planning to help define program timelines and enablement requirements

Work with Internal teams to put in place new capabilities to meet timelines

Work with suppliers on new packaging technology / material / capability / equipment requirement

Work with Process and Equipment counterparts in manufacturing on new equipment benchmarking

Key member in driving KEG (Key Equipment Group) and KMG (Key Material Group) programs to maintain strong working relationship with key suppliers

 

Ensure smooth transition from new process development, qualification, small volume production to high volume

Lead a team of Engineers and Eng Assistants in the development and Qualification of new packaging process and equipment solutions to meet Business Unit requirements

At initial transfer foster an environment where development and manufacturing teams are closely linked for pilot production input and process validation leading to successful High Volume

Startup pilot line for new packages and work on yield improvement activities for initial production volume run

Provide proper Documentation for product transfer to manufacturing

Understand the capabilities of the internal sites and work with the Global team on packaging solutions that will be transferable while leveraging advances

 

Technical Leadership

Understand the future trend, technology and capabilities required for future packaging solutions

Provide general packaging leadership and strategy to influence Micron’s technical direction

Work with Internal teams to put in place new capabilities to meet future needs

Foster an environment of innovation to enable novel processes

 

Manage People and Develop Careers of the Section Team Members

Manage a team of engineers and engineering assistants

Foster a vibrant, energetic work environment, with a sense of urgency

Provide training and career development for engineers and engineering assistants

 

Supervise Technical Publication and Patent Disclosure

Supervise and encourage engineers and engineering assistants in publishing technical papers and patent disclosure submission

 

Ensure a Safe, Compliant, and Ethical Work Environment

Maintain knowledge of, and apply, company safety, labor, and ethics policies

Communicate requirements and expectations to leaders and external stakeholders

Identify, resolve and / or report potential safety, security, and labor issues

 

Qualifications

Degree

MS or PH.D. or Equivalent Work Experience Required

 

Requirements

7+ years’ engineering and leadership experience in semiconductor industry including 5+ years of successful management experience within a development environment

Experience and technical knowledge with die and wafer level process and equipment

An understanding of Micron’s silicon and how it interacts at a package level through CPI is a plus

Proven track record in motivating teams and fostering teamwork through clear and open communication

Leadership and strategic planning capability

Strong project management skills to ensure execution to timelines

Understanding of business needs and customers’ requirement

Ability to cooperate with people of different levels inside/ outside the company

Ability to empower others to achieve results through motivation, recognition and performance feedback

Strong negotiation and collaboration skills

Excellent English skill both in Oral and Written

Periodic international travel is required

 

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

 

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

 

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

 

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan, China (TW) || Technology Development || Experienced || Regular || Engineering || #LI-CY1 ||
 

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