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ADVANCED PACKAGE DEVELOPMENT ENGINEER

Taichung, TXG, TW

Req. ID: 196662 
 

Micron in Taiwan

Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM.

Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles.

 

Specific Responsibilities: 

  • Advanced package technology (chip stacking, 2.5D or 3D) research and development
  • Familiar with chip to substrate or chip to wafer interaction
  • Familiar with TCB(thermal compression bonding) process
  • Familiar with JMP data analysis and DOE matrix design
  • Process problem identification and solving
  • Work effectively to produce cross sections cooperation

 

Qualifications:

  • MS or Ph.D. with an engineering major
  • 3 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred
  • Innovative with independent thinking
  • Good team player with a high motivation
  • Fluent communication in both English and Chinese

 

 

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 and/or by completing our General Contact Form

 

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || College || Regular || Engineering || #LI-JS1; #LI-NH1 || Tier 3 || 

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