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ADVANCED PACKAGE DEVELOPMENT ENGINEER - CVD

Taichung, TXG, TW

Req. ID: 197141 
 

Job Description:

As an Engineer in Micron’s Advanced Packaging Technology Development group at Taiwan Taichung, you will contribute at a high level as part of process technology team to develop deep sub-micron generation production-worthy, CVD/PECVD processes. You will provide ownership for both process development & related tool issues for specific films/processes.  You will also be responsible for incorporating these processes into corresponding process flow for application in high density advanced memory.

 

Specific Responsibilities:

  • To suggest process alternatives and evaluate different options that may provide improved film properties and higher process margins.
  • To plan and execute effective, well-designed experiments and write clear, concise reports documenting the results.
  • To evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis.
  • To interact and collaborate with integration engineers to develop robust film and related module as well as deploy the process to the production fabs
     

Qualifications:

  • Experienced Fab research and development in thin films deposition on microelectronic devices.
  • The ability to work with a wide variety of people in different areas of process, integration, and pilot line production to effectively accomplish tasks in a timely manner.
  • An understanding of electronic material properties, thermal dynamics, chemical kinetics, plasma physics and chemistry, vacuum physics, and their direct application to thin films deposition processes in various deposition methods.
  • Fundamental plasma processing and their impact on film properties.
  • Statistical analysis, SPC/DOE.
  • Thin films fundamentals and roles in all processing steps of forming memory devices, peripheral devices and their IC circuit.
  • Fundamental challenges in material exploration for device scaling.
  • Various types of physical film analysis techniques such as SEM/EDS, TEM/EELS, XPS/AES, SIMS, RBS, ICP-GDMS, AFM, XRR, and XRD.
  • Various thin film electrical evaluation methods and techniques.
  • The ability to be a self-motivated team player.
  • The ability to be highly motivated and goal oriented.
  • The ability to aggressively focus on solving problems both as part of a team and individually.

 

Education and Job experience

  • MS/PhD with an engineering major
  • 3 year or above experience in semiconductor process, assembly process, or substrate process technologies is preferred
  • Fluent communication in both English and Chinese

 

According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 and/or by completing our General Contact Form

 

Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Experienced || Regular || Engineering || #LI-CY1 || Tier 3 || 

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