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2021 Intern - APTD R&D PWF PROCESS

Taichung, TXG, TW

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

 

Req. ID: 267042 

 

Job Description:

The APTD Intern is responsible for assisting new Technodes process development and transference for mass production. The candidate should well understand site, department, area goals and subsequently assist team to achieve them by communicating with supervisor. He or She is required with great accountability to take a responsibility for all tasks assigned timely and accurately.

 

Specific Responsibilities:

  • Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
  • Characterize adhesive properties in wafer bonding technology
  • Study thermal effect on wafer warpage behavior
  • JMP data analysis and DOE matrix design
  • Assist process problem identification and solving in advanced package
  • Work effectively to produce cross sections cooperation

 

Qualifications:

  • Major in engineering science that semiconductor process, assembly process, or substrate process technologies is preferred
  • Innovative with independent thinking
  • Good team player with a high motivation
  • Fluent communication in both English and Chinese

 

重點目標 Object

HBM3 Wafer Support System of Advanced Package through PWF/Assembly Flow

 

實習內容/專案  Content/Project of internship

1.     Understand and investigate bonding process parameters and adhesive properties critical to wafer warpage and yield 

2.     JMP data analysis and DOE matrix design

 

Important: Please must download 2021 Micron Internship Application Form to fill in and upload it in the attachment, thank you!

https://media-staging.micron.com/-/media/client/global/documents/general/jobs/2021-micron-intern-application_tw.docx?la=zh-tw&rev=5f4d36d5a3754e888ca8f15163feb20d

 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.

 

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

 

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Technology Development || Intern || Internship || Engineering || #LI-NH1 || Tier 1 || 

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