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Singapore, 01, SG

Req. ID: 283241 



Package & Assembly engineering team world-wide is responsible for delivering robust, reliable, cost-effective package aligned with the end-product requirements. This involves participation in core teams, co-working with other groups in Micron such as Design, Fab, Marketing, Product and Test Engineering, Package Development and Assembly counter-parts and manufacturers in Asia with respect to package design, substrate layout, substrate manufacturing technologies and qualification and ramp to meet the deliverables and expectations.

 ESSENTIAL DUTIES AND RESPONSIBILITIES: include the following, other duties may be assigned as necessary.

Job Description

Candidates will be responsible for designing and doing package design and substrate layout and presenting it in front of Business Units and customers (as needed) while working with development and assembly groups within Micron and OSASTs.  Thus, candidates will have full package design responsibility.

As a Senior Package Design Engineer at Micron Semiconductor Asia Operation, you will be providing package designs for advanced semiconductor packages. You will be working with a cross-function team across several geographies and sites to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation.

 You will be required to complete design activities within the project schedule and ensure design outputs are able to meet assembly rules and vendor capability.  Other Package Design Engineering job responsibilities include ability to perform basic electrical/thermal simulation tasks of advanced electronic packages

Design Coordination and Management

  • Support feasibility studies for various package options.
  • Interact with and support die design to enable silicon architecture development.
  • Interact with key Business Unit stakeholders and recommend package solutions to meet customer and/or market requirements.
  • Establish design gap analysis for subcontractor proposals.
  • Support package technology development activities.
  • Support packaging IP development.
  • Provide design support for thermal/mechanical/electrical simulation analysis.
  • Support the design group’s continuous improvement efforts.
  • Support global design alignment activities.
  • Contribute to package design rule and system development.
  • Contribute to package roadmaps.
  • Contribute to the Competitive Analysis review process.

 Create Package Designs

  • Support die padslog layout/optimization
  • Design for optimum electrical performance, manufacturability, and package reliability
  • Perform cross-functional team design reviews (Global Assembly, Test, QA and External Programs)
  • Execute interposer supplier design reviews in a timely and efficient manner
  • Perform direct design reviews with assembly subcon design teams
  • Participate in the DFMEA process

 Generate Documentation

  • Maintain familiarity with documentation work flows and signoff flows
  • Ensure accurate and timely update of all documents into the Assembly Database
  • Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
  • Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams

 Contribute to a Safe and Compliant Work Environment

  • Identify and promptly report hazards
  • Follow safety procedures and area work rules
  • Use proper lifting techniques and work in an ergonomically correct manner



You will be required to research design rules and industry drafting standards to maintain global consistency and accuracy of design drawings.

Other CAD Engineering job responsibilities include performing design feasibility studies with written reports of findings; communicating with customers to resolve manufacturing issues; and working with software companies to develop software solutions; and writing software codes for automation.

 Responsibilities and Tasks

Create and Modify Drawings

·         Utilize appropriate design rules for package application 

·         Design for optimum electrical performance, manufacturability, and package reliability 

·         Work through required engineering teams to establish relevant design rules and updates 

·         Perform on time package design rules update to the design rule system 

·         Create initial circuit board layout feasibility reports 

·         Perform circuit board route studies 

·         Perform cross-functional team design reviews 

·         Resolve substrate manufacturing issues (Vendor Design Approval)                                                            


Support and Develop Software Solutions                                                                                                                  

·         Document and communicate software issues to supplier 

·         Debug and implement software upgrades to all sites 

·         Write and maintain software automation scripts 

·         Develop software to meet engineering support groups requirements

Manage Projects                                                                                                                                                            

·         Use project-tracking methods 

·         Meet project timelines 

·         Write project reports documenting results obtained

Follow Drafting Standards                                                                                                                                            

·         Apply ANSI standards 

·         Apply Micron standard 

·         Apply Geometric Dimensioning and Tolerancing principles

Contribute to a Safe and Compliant Work Environment

·         Identify and promptly report hazards



  • Bachelors above Degree in Mechanical Engineering or Electrical Engineering
  • 10 years’ experience working experience in Package design, PCB Design, Assembly process, Assembly materials, Product Engineering, Quality and Reliability
  • Proficient in Cadence (SiP Digital Layout or Allegro Package Designer software and System Connectivity Manager)
  • Proficient in AutoCAD 2D and 3D (Inventor a plus)


  • Masters or Bachelors Degree in Engineering
  • 5 years’ experience in any of the following: working experience in any of the following: Package design, PCB Design, Assembly process, Assembly materials, Product Engineering, Quality and Reliability
  • Experienced candidates will be considered for managerial or senior position
  • Good computer skills and proficient in MS Office
  • CAD experience
  • Detail orientated
  • Strong oral and written communication skills
  • Ability to interact and work in a team environment
  • Fundamental electrical circuit knowledge
  • Ability to read an interpret drawings and schematics
  • Ability to prioritize and manage multiple projects
  • International travel may be required on a quarterly basis
  • Work environment will be office (cubical)

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Singapore || Central Singapore (SG-01) || Singapore (SG) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-RL1 ||

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