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Package Simulation Engineer ( Fresh grads are welcome to apply)

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Date: Aug 19, 2019

Location: Singapore, 01, SG

Company: Micron


Req. ID: 134151 


As Package Simulation Engineer, you will be responsible to provide Finite Element (FE) simulation support for design feasibility studies and technical risk assessment in various IC (Integrated Circuit) packaging design. You will be working with cross-function teams and manufacturing sites across several geographies to support thermo-mechanical & mechanical simulation studies. Simulation findings from your work will lay the groundwork for Team to formulate best-in-class packaging design strategies, process optimization and material selection criterion in enabling product robustness to meet various customer requirements.


Job Description:


  • Perform FE simulation support for thermo-mechanical analysis: Strip-Level & Component-Level Warpage / CTE Mis-Matched Stress
  • Provide FE simulation support for mechanical analysis: Static & Dynamic Flexural Bending / Encapsulation Moldflow Filling
  • Utilize Computer Aided Engineering (CAE) software tools to support various functional groups: Package Design & Development, New Product Introduction, Advanced Deployment, Process & Equipment Engineering, Product Engineering, Package Quality Reliability and Customer Support Teams.
  • Assist Package Design Team to define a spectrum of design guidelines for optimal and cost-effective IC packaging options in TSOP, COB, BOC, MCP, Flip Chip & TSV products.
  • Conduct feasibility study and technical risk assessment to identify potential qualification risks in new product launches.
  • Establish new modeling approach, perform model correlation and refine existing modeling methodology for prediction accuracy enhancement.
  • Develop modeling technique to address new design / process / customer requirement.
  • Collaborate with laboratories on detailed material characterization for material modeling inputs.


Job Requirements:


  • Minimum bachelors in engineering 
  • CAE simulation software experiences with ANSYS APDL scripting and/or Moldex3D is preferable
  • Strong technical interest in structural mechanics, material science and Finite Element Method
  • Proficient in MS Office and familiar with AutoCAD software
  • Strong oral and written communication skills
  • Ability to interact and work in a team environment
  • Ability to prioritize and manage multiple simulation projects


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Singapore || Central Singapore (SG-01) || Singapore (SG) || Backend Manufacturing || College || Regular || Engineering || #LI-MH2 || Tier 3 || 

Job Segment: Package Design, Manufacturing Engineer, Engineer, CAD, Manufacturing, Engineering, Customer Service