Share this Job
Apply now »

PDE Senior/ Process Integration Engineer

Singapore, 01, SG

 

Req. ID: 175325 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

Do you strive in a dynamic work environment? We are looking for highly motivated and dedicated individuals to join us as a Senior Integration Engineer in the Package Development Engineering Team

As a Senior/ Integration Engineer in Micron's Package Development Engineering Team you will be responsible for driving leading edge technode development. You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan. Demonstration of the technology is shown through meeting the requirements for thermal, mechanical, electrical, reliability and customer specifications. You will drive the technology development through multiple phases of maturity and contribute to Micron's strategic objectives of Technology leadership.

Key Responsibilities:

  • Understand the roadmap for silicon and package technology for different market segments and work to identify solutions to meet business needs.
  • Develop and execute the plan to integrate new silicon technology with new package technologies for various memory applications to address Chip Package Interaction (CPI) issues.
  • Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
  • Work with silicon, package and saw street designers to find solutions and implement relevant design rules.
  • Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues and improve yield, quality and manufacturability.

Qualifications:

  • Minimum of 5 years experience in R&D or manufacturing wafer fab preferably in process Integration positon.
  • Similar experience in IC Package development with exposure to front end fab process.
  • Fab metallization or BEOL integration and cross-functional project management experience highly preferred.
  • Strong interpersonal, oral and written English communications-skills.

Education:

  • M.S. in Electrical Engineering, Microelectronics, Physics, or Material Science Engineering, PhD preferred Or Equivalent work experience


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Singapore || Central Singapore (SG-01) || Singapore (SG) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-MH2 ||
 

Upload your resume and immediately see jobs for you!


Job Segment: Electronics Engineer, Process Engineer, Manufacturing Engineer, Engineer, Electrical, Engineering

Apply now »