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Date: Jun 24, 2018

Location: Singapore, 01, SG

Company: Micron


Req. ID: 101864 


As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliability test results. You will also be expected to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMA’s, and prepare reports for discussion. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.


Successful Candidates for this position will have:

  • Thorough knowledge of semiconductor component package assembly processes and challenges
  • Knowledge of surface mount processes and challenges
  • Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
  • Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability
  • A working knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred
  • Must be self-motivated, able to work independently, and detail oriented
  • Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
  • Good written and verbal communication skills are computer skills are necessary
  • Working knowledge of the software systems employed in backend manufacturing is a plus


Qualification Requirements:

  • Minimum of BS degree, M. Sc or equivalent experience in Engineering or a related field of study. 
  • Five years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, Failure Analysis, or a related field preferred.


Location: MSB - 990 Bendemeer Road, Singapore 339942

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Singapore || Central Singapore (SG-01) || Singapore (SG) || Quality || Experienced || Regular || Engineering || #LI-SING  ||

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