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Date: Jul 8, 2018

Location: SINGAPORE, 03, SG

Company: Micron


Req. ID: 111206 

GQ – PQRA Package Lab Engineer


As a Global Quality (GQ) Product Quality and Reliability Assurance (PQRA) Package Lab Engineer at Micron Technology Inc., you will develop, maintain, and improve Failure Analysis (FA) and characterization methods for microelectronics packages and PCB Assemblies, and will specify and improve processes, select equipment, and interpret test results with respect to industry standards and Micron requirements. In support of these responsibilities, you will develop and maintain knowledge of leading-edge technology, and may work on projects that advance the leading-edge. Additionally, you will respond to inquiries from internal and external customers as a subject matter expert for lab activities.


Responsibilities and Tasks

Manage New Package/Module Qualification

  • Understand package/module details and analyze risk
  • Define qualification plan
  • Facilitate and manage qualification
  • Resolve failures and define failure rate within the scope of the qualification
  • Perform risk assessment at all decision points within qualification cycle
  • Drive corrective action

Develop Package/Module Reliability Methods and Standards

  • Collaborate with Assembly Engineering to assess risk of new package designs, processes and technologies
  • Develop reliability tests to assess new package failure mechanisms and processes/technologies
  • Develop Reliability Process Monitor (RPM) plans

Support Deviant Material Disposition

  • Assess deviation for product quality and reliability risk
  • Define and coordinate testing necessary to evaluate deviant materials
  • Recommend disposition of deviant material
  • Coordinate root cause and corrective action effort

Provide Technical Support to Return Material Authorization (RMA) Teams

  • Assist RMA teams with analysis of returned material
  • Provide input on reliability history and known issues relative RMA
  • Develop a testing plan to assess risks related to RMA fails
  • Analyze failure rate to assess risks

Provide Technical Expertise to Internal/External Customers

  • Respond to customer requests via QA Request System in a timely manner
  • Support audits as needed
  • Collect, analyze and report data
  • Collaborate with customers to develop custom test methods
  • Perform custom testing
  • Communicate customer trends/needs to package manufacturing and design teams
  • Communicate directly with customers as needed
  • Review customer qualification specifications

Manage and Develop the Team (Supervisors)

  • Coach and provide career development
  • Identify strengths and create specific development plans
  • Establish goals and conduct performance appraisals
  • Remove barriers
  • Provide recognition and drive accountability
  • Gather and act on feedback
  • Develop project management skills within the team



  • Bachelor Degree or equivalent experience in Engineering (or Related field of study). Materials Engineering, Materials Science, Mechanical Engineering is preferred.
  • A minimum of 3 years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, Package Characterization/Failure Analysis is preferred.
  • Knowledge of microelectronics component or module/assembly processes and materials.
  • Knowledge of microelectronics failure analysis and characterization methods and industry standards (e.g. JEDEC, IPC, AEC).
  • Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies.
  • Understanding of the effects thermo-mechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability.
  • Understanding of material testing and metallurgy fundamentals.
  • Knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred.
  • Knowledge of DOE methods.
  • Strong analytical problem solving skills.
  • Ability to work well independently and in teams.
  • Good written and verbal communication skills.
  • Fresh graduate is encourage to apply


Location: MSB - 990 Bendemeer Road, Singapore 339942



We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  SINGAPORE || North West (SG-03) || Singapore (SG) || Quality || College || Regular || Science/Laboratory || #LI-KL1 ||

Job Segment: Package Design, Electronics Engineer, Metallurgy, Laboratory, Materials Science, Manufacturing, Engineering, Science