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Assembly Process Engineer - Wafer Thinning

Penang, 07, MY


Req. ID: 273223 


Senior Assembly Process Engineer - Wafer Thinning


As a Wafer Thinning Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives. 


Responsibilities and Tasks :

  • Evaluate and Improve Wafer Thinning Assembly Processes, Materials, and/or Equipment  Maintain in-depth process knowledge
  • Maintain materials and equipment knowledge as it relates to the process and how they interact
  • Optimize process and/or equipment variables by apply DOE techniques
  • Maintain knowledge of material attributes (shelf life, storage requirements, etc.)
  • Define process edges and center the process (CPK)
  • Determine root cause and implement corrective actions
  • Define and maintain operation procedures


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || College || Regular || Engineering || #LI-JT2 || Tier 3 || 

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