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Wire Bond Development Engineer

Date: Aug 7, 2019

Location: Muar, 01, MY

Company: Micron

Req. ID: 137351 

Recruiter: Sarina Binti Madarasa 



  • Responsible for process development of pre-wire bond plasma and wire bonded process.
  • Establish and setup new pre wire bond plasma/wire bond assembly process capabilities and materials including hands-on equipment setup.
  • Monitor performance, quality and reliability of assembly processes. Identify problems or unfavorable deviations and recommend and implement corrective and improvement actions.
  • Responsible for new equipment benchmark, optimization, capability roadmaps and tooling equipment.
  • Support new package development, ramp ups and platform extensions.
  • Support process roadmap updates for newly developed package technology.




  • Bachelor degree in Electrical & Eletronics Engineering, Material Engineering, Material Engineering or similar degree.
  • Candidate must possess minimum 5 years in semiconductor industry in the field of package development or assembly engineering.
  • Experienced in plasma, wire bond process in IC assembly industry.
  • Good knowledge of design rule, FMEA, DOE, SPC, risk analysis, data analysis.
  • Knowledgeable in IC Packaging Assembly Process Flow.
  • Knowledge of wire bond tooling design, Si technology and/or equipment troubleshooting will be an added advantage.
  • Independent with good communication and co-ordination skills.
  • Great team work within the team and cross functional team.



We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-LT1 || Tier 3 || 

Job Segment: Semiconductor, Manufacturing Engineer, Engineer, Electrical, Plasma, Science, Engineering