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Process Integration Engineer

Date: Aug 12, 2018

Location: Muar, 01, MY

Company: Micron

 

Req. ID: 117983 

An Assembly ADT PI Engineer is responsible for transfer, successful qualification and ramp to HVM on time of Micron memory packages (NVM). The Assembly ADT PI Engineer is responsible to meet the project milestone and meet the assembly, test and reliability requirement of the package. He/She must interface with package design team, define/develop BOM and process flow, a point of contact with the Product Engineering Group, Quality and Reliability Group, Test and Post Electrical group as well as the External Manufacturing Engineering. He/She will act as project manager of the product he owns, prepare specs, engineering instruction, assembly reports that are required for product release and qualifications.

 

Responsibility:

The responsibilities of the Assembly ADT PI Engineer include and not limited to the following:

  • Defining the Build of Material (BOM) for all packaging level products.
  • Ensure Engineering samples and qualification samples are on time and achieve 1st time successful product qualification release.
  • Ensure products meet yield / quality / reliability expectations.
  • Maintain a matrix of key performance indices and drive improvement through team-based continuous improvement activities / projects.
  • Leverage knowledge of experts across functions to successfully launch new technologies in packaging.
  • Use structured problem solving techniques and lead team problem solving efforts.
  • Identify projects, coordinate and evaluate controlled experiments. Know how to validate experimental data and make data driven decisions.
  • Communicate product and project information to departments outside of Assembly.
  • Act as the point of contact for product/project related issues.
  • Work closely with Global Product Engineer counterpart to ensure consistency across the network.
  • Act as a point of contact for Quality and Reliability Assurance (QRA) on returned merchandise (RMA).
  • Support process improvements (die and package).
  • Work across global internal and external manufacturing sites to drive product quality through BKM sharing and alignment programs
  • Communicate product and project information to departments outside of Assembly
  • Enlist the support of management
  • Send weekly product/project team updates to team members and management team
  • Act as the point of contact for product/project related issues
  • Prepare Change Control Documents and present the change to Change Control Board(CCB)
  • Be able to apply MSSR (Mean Shift/Sigma Ratio) for Site Equivalency.

 

Education:

Minimum must have Bachelor’s Degree in Engineering from a recognized university or related field equivalent technical work experience.

 

Experience:

  • highly motivated individuals with at least 5 years' working experience are encourage to apply.
  • Good understanding of Assembly processes preferred.
  • Understanding of the interaction Assembly Process and Materials (substrate, mold compound, silicon) specifically for Package Warpage is preferred.
  • Electrical and Mechanical and Material Science knowledge will be an added advantage.
  • Statistical and DOE skills is preferred

Desired Behaviors:

  • Demonstrate teamwork, self-development, drive for results, integrity, and trust.
  • Excellent organizational skills.
  • Good problem solving skills with the ability to work independently.
  • Excellent interpersonal and communication skills.
  • English speaking competency- strong written and verbal skills
  • A high level of motivation, self-directed and goal-oriented
  • Demonstrate ability to team-build, specifically the ability to lead and manage a team through influence without direct authority.

 

 


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-LT1 ||
 


Job Segment: Process Engineer, Manufacturing Engineer, Engineer, Electrical, Package Design, Engineering, Manufacturing