Share this Job

Manager, New Product Management 1

Date: Jun 20, 2019

Location: Muar, 01, MY

Company: Micron

Req. ID: 132961 

Recruiter: Lydia Tan 

Responsibilities include but are not limited to:

  • Managing team of new package management
  • Communicating department goals and providing periodic department updates to upper management
  • Defining, managing, and monitoring KPI of department
  • Motivating team members to be hypothetical and innovative
  • Being the contact window to the Business Unit’s NPI
  • Taking care of team members career development innovative
  • Coordinate Stage Gate Review as per Project Plan & Demand
  • Establish Network NPI Business Process

           - OTD/Cycle Time

           - Qual/LVM success rate

           - NPI Lot Completion

           - NPI Inventory control & disposition 

           - Routing & Process Flow

           - Establish methodology & KPIs (Network)

           - NPI 1st time right

           - Safe Launch

 

Qualifications:

  • Experience in IC Package development & New Product Introduction
  • Experience with package development on BGA/eMMC/MCP with mobile packaging a plus
  • Knowledge of product life cycle
  • Knowledge of APQP
  • Knowledge of package reliability and failure modes
  • Experience working with customers
  • Strong interpersonal- and communications-skills
  • Strong organizational skills
  • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why,TOC etc.).
  • Basic understanding of package development flow Qual->LVM->HVM, Assembly, test, Package reliability.
  • Generate Process flow, update system & T-card. 
  • Consolidate key gap closure action items and drive execution.
  • Facilitate collection of data required to make risk decisions
  • Ensure timely resolution of project team action & packaging issue items
  • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.

 

Education:

  • Master’s degree in Mechanical/Material/Electrical/Physics Engineering  
  • 5+ years of experience in new product activities related to electronic packaging.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

 

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

 

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

 

Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-LT1 || Tier 4 || 


Job Segment: Manager, Engineer, Electrical, Product Manager, Compliance, Management, Engineering, Operations, Legal