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Assembly NPI Process Engineer

Muar, 01, MY


Req. ID: 190141 




  • Responsible for process development of die prep, die attach, wire bond, or solder ball attach process.
  • Establish and setup new assembly process capabilities and materials including hands-on equipment setup.
  • Monitor performance, quality and reliability of assembly processes. Identify problems or unfavorable deviations and recommend and implement corrective and improvement actions.
  • Responsible for new equipment benchmark, optimization, capability roadmaps and tooling equipment.
  • Support new package development, ramp ups and platform extensions.
  • Support process roadmap updates for newly developed package technology.




  • Bachelor degree in Electrical & Eletronics Engineering, Material Engineering, Chemical Engineering or similar degree
  • Good knowledge of numerical methods, thermodynamics, mechanics of material, mechanical designs, dynamics and finite element
  • Knowledge in statistical knowledge is an added advantage
  • Independent with good communication and co-ordination skills.
  • Great team work within the team and cross functional team.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Muar || Johor (MY-01) || Malaysia (MY) || Backend Manufacturing || College || Regular || Engineering || #LI-LT1 || Tier 3 || 

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