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ASIC Package Design Engineer(Senior/Principal)

Hyderabad, AP, IN

Req. ID: 152084 


Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to collaborate with a team of industry authorities to build products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team.

As an ASIC package designer at Micron Technology, Inc., you will be responsible for the enablement of complex flip-chip package layouts that meet exceptional technical standards, including electrical, mechanical and thermal performance. In this highly visible role, you will own and drive advanced package design and development for advanced flip-chip packages. You will have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out.


  • Minimum 8+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must
  • 5 + years’ experience in packaging area with flip-chip design
  • Design, Route, model and validate silicon package substrate designs critical to high speed networking product requirements. It is critical to understand manufacturing design rules, Signal Integrity and Power Integrity requirements to minimize package iterations and build working designs.
  • Creation and Management of Schematic and Netlist using appropriate tools.
  • Ability to travel internationally as required


  • Design Focus will be primarily on flip chip packages and heterogeneous integration chip package design.
  • Setup the design, create complex routing standards and design rules
  • Implement package route to meet the rules required for very high speed serdes and large pin count devices.
  • The role will require interaction with physical design teams, foundry suppliers and variety of other partners.
  • Capability of understanding and working towards landmarks to make development successful. Managing and tracking number of iterations with pcb, connector, and asic team will be required.
  • A complete knowledge of packaging materials and material properties is plus. The knowledge of 2.1D, 2.5D and interposer integration is desired

Create Package Designs

  • Execute advanced package design reviews in a timely and efficient manner
  • Support die padslog layout/optimization
  • Design for optimum electrical performance, manufacturability, and package reliability
  • Perform direct design reviews with assembly subcon design teams
  • Participate in the DFMEA (Design for Manufacturing) process

Generate Documentation

  • Maintain familiarity with documentation work flows and signoff flows
  • Ensure accurate and timely update of all documents into the Assembly Database
  • Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
  • Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, etc.

Micron is an equal opportunity employer and values diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.



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