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Thin Film Process Development Engineer

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Date: Jan 11, 2019

Location: Boise, ID, US

Company: Micron

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

 

As a Thin Film Process Development Engineer at Micron Technology, Inc., you will contribute at a high level as part of process technology team to develop deep sub-micron generation production-worthy, low cost processes, including LPCVD/PECVD, ALD/PEALD, diffusion, ALO, RTP, and PVD.  You will provide ownership for both process development & related tool issues for specific films/processes.  You will also be responsible for incorporating these processes into corresponding process flow for application in high density advanced memory parts, primarily 3D NAND applications.

 

Responsibilities include, but not limited to:

 

  • A minimum of 3 years of experience or equivalence in thin films research and development, preferably with experience in deposition for microelectronic devices
  • Work with a wide variety of people in different areas of R&D process, integration, pilot line, and high-volume production to effectively accomplish tasks in a timely manner
  • Plan and execute effective, well-designed experiments and write clear concise reports documenting the results
  • Recognize, suggest process alternatives, and evaluate different options that may provide improved film properties and higher process margins
  • Give and take constructive criticism from other team members and leverage input to drive projects forward
  • An understanding of:
    • Chemical kinetics, thermal dynamics, plasma physics and chemistry, vacuum physics, and their direct application to thin film deposition processes including diffusion, LPCVD/PECVD, ALD/PEALD, PVD, and ALO deposition processes in various deposition reactors
    • Electronic material properties resulting from various types of deposited thin films. Fundamental plasma processing and their impact on film properties. Statistical analysis, SPC/DOE. Thin films fundamentals and roles in all processing steps of forming memory devices, peripheral devices and their IC circuit. Fundamental challenges in material exploration for device scaling
    • Various thin film electrical evaluation methods and techniques such as leakage, impedance, capacitance
    • Various thin film physical and chemical evaluation methods and techniques such as SEM/EDS, TEM/EELS, XPS/AES, SIMS, RBS, ICP-GDMS, AFM, FTIR, Raman Spectroscopy, XRR, and XRD
    • Micro- and/or nano-mechanical structures
    • Thin film linear and non-linear mechanical behaviors and modeling
  • Experience and knowledge of Fab metrology tools such as optical/electrical methods
  • Evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis
  • Interact and collaborate with integration engineers to develop robust film and related module as well as deploy the process to internal customers in R&D and the production fabs
  • Self-motivated team player and be adaptable to Micron's changing needs including working extended hours if required
  • Highly motivated and goal oriented, open to learning new skills and strong collaboration skills
  • Problem solving skills both as part of a team and individually
  • Excellent verbal and written communication skill
  • Dependability and the willingness to take responsibility for the development of a process and tool

 

Minimum Qualifications:

 

Ph.D in Materials Science and Engineering, Chemical Engineering, Physics, Chemistry, Electrical Engineering or similar field. Extensive process development experience may substitute for Ph.D.

 

About Us

 

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

 

Micron Benefits

 

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

 


Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-SC2 ||


Nearest Major Market: Boise
Nearest Secondary Market: Meridian

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