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Technology Development Engineering Leader

Boise, ID, US


Req. ID: 139790 


Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Module Integration Leader within the Technology Development Engineering Group at Micron Technology, Inc., you will be working in an industry leading 300mm R&D facility on technologies which enables future memory scaling. You will be responsible to establish long term technology roadmaps and project milestones for developing innovative solutions to close critical technology gaps. It is essential that you are able to lead development projects including both internal and external resources. In addition to a broad basis of Process Integration knowledge, this role is also required to have device physics expertise and will contribute to the development of Future Memory specific devices. Significant interaction with simulation, modeling, characterization, and reliability groups is encouraged.


For this position we require creative problem-solving skills focused on devising and optimizing process flows which enable future memory chip integration. As an integral part of R&D, you will engage with numerous cross-functional teams including Process Development, Product Engineering, Design, Yield Enhancement, Advanced Mask, Probe, etc. to arrive at optimal technology solutions.


Responsibilities include but are not limited to:

  • Lead technical investigations and Module development including vehicle selection to meet performance metrics for advanced devices
  • Engage with partners across global organizations, engineering teams, and R&D fab to coordinate and align process technology roadmap activities
  • Coordinate experimental design and analysis of candidate process sequences and materials/methods
  • Lead and coordinate project activities across cross-functional teams
  • Coordinate and prioritize work of self and others and work with business patterns for setting and achieving milestones in a timely manner



  • Success in our multi-tasking team environment requires excellent communication, organizational management, and team building skills.
  • Proficient experience with Process Integration and module development is required.
  • Expertise in fundamental physics of device operation including charge transport concepts and knowledge of films conductivity and contact resistance challenges
  • Ability to work on multiple projects and work through cross-disciplinary and cross-organizational logistical issues.
  • Proactive approach to problem/project management and Proficiency with data analysis, DOE, and statistical techniques is assumed.
  • Strong communication and reporting skills both written and verbal.
  • Ideally, the candidate will have a detailed knowledge of mainstream memory technologies and understanding of the challenges and opportunities facing alternative memory technologies



  • MS or PhD in Electrical Engineering, Physics, or other related technical field is required
  • 5+ years of Process Development and/or Process Integration desired
  • Other background may be considered in light of experience specific to this job.




All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-JF1 || Tier 5 || 

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