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Senior Signal Integrity Engineer

Boise, ID, US

 

Req. ID: 227570 

 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. 

Description

Micron’s Signal Integrity Research and Development (SI R&D) group supports all current and future product development, including DRAM, LPDRAM, NAND, NOR, 3DXP, DIMM modules and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses. The SI R&D works on analysis of end to end systems solutions including but not limited to circuit level, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions. The team owns all steps of the signal and power integrity support process including die and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. The team also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically challenging, team-oriented, collaborative and customer-centric. 

Within the larger SI R&D group, as a Senior Signal Integrity Engineer at Micron, you will be responsible for

  1. Leading out in the design and analysis of high speed (HS) memory interfaces and power distribution networks (PDN).
  2. Leading out in SI/PI development across a broad range of Micron’s portfolio to ensure product electrical performance through modeling, simulation, analysis, and correlation to measurement for the various products.
  3. Representing the SI R&D team in technical cross functional collaborative groups, and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance.
  4. Driving and development of SI/PI aspects of future standards (including but not limited to JEDEC, ONFI, and IBIS) through system and product electrical capability exploration.
  5. Supporting external customers with their design challenges
  6. Providing expert SI PI support for Field Apps teams
  7. Developing methodologies and processes for SI/PI analysis
  8. Establish and communicate best know SI design methods to external customers
  9. Supporting (and in some cases driving) path-finding activities for IO and channel innovation to enable next generation of memory technologies at higher speeds and densities

 

Qualifications

Successful candidates for this position will have: 

  • PhD or MSEE w/10 years of industry experience
  • Strong SI/PI/EMI theory and application, modeling, analysis, simulation
  • Signal and Power Integrity Background, particularly in areas that affect I/O circuit and signaling performance.
  • Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience.
  • Experience with, and intermediate working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc..
  • Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface signaling, and termination schemes. 
  • Deep understanding of frequency and time domain aspects of channel analysis, as well as a deep understanding of spectral content of time domain signals. 
  • Experience in designing all aspects of systems for optimal channel signaling and optimal power integirty performance. 
  • Deep understanding of timing budgets,  jitter analysis, pulse distortion anlysis. 
  • Deep understanding of Equalization circuits and techniques like, DFE, CTLE, FFE. 
  • Deep understanding of crosstalk and ISI mitigation strategies in printed circuit boards and systems. 
  • Strong command of Power Delivery Network (PDN) design, regarding the VRM, PCB, package, and silicon die. 
  • Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques.
  • Experience in design and analysis of high-speed single-ended or differential buses
  • Familiarity with, and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
  • Familiarity with statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial
  • Desirable Mixed-signal Circuit Design Background
  • Desirable Memory industry experience
  • Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths.

 

 

Successful candidates for this position will be:

  • Pro-active – Candidate will be expected to identify gaps and opportunities and address them with minimal supervision.
  • Visionary – Candidate will be expected to think “outside-the-box” and yet offer innovative solutions within a set of practical constraints.
  • Communicator – Candidate should be able to clearly convey necessary details of complex issues and corresponding solutions in both written and verbal formats.

 

About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Boise || Idaho (US-ID) || United States (US) || CNBU (Compute & Networking Business Unit) || Experienced || Regular || Engineering || #LI-RS1 || Tier 4 || 

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