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Semiconductor Stress Modeling Engineer

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Date: Mar 11, 2019

Location: Boise, ID, US

Company: Micron

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Wafer Level Semiconductor Mechanical Stress Modeling Engineer at Micron Technology Inc, you will be responsible for analyzing & modeling thermal/mechanical stress during semiconductor memory fabrication processes and responsible for stress-mitigation options/designs in our current and future technologies. You will be studying thermal/mechanical stress at key process integration steps (including both front-end-of-line (FEOL) and back-end-of-line (BEOL)) using commercial or in-house FEM (Finite Element Model) tools, where applicable. You will communicate and collaborate with a variety of teams including process integration, process modules, scribe & layout designs, and package to evaluate process & design margins and debug stress-related issues during process development and technology pathfinding. Additional responsibilities include project management and tracking, working with a global team in multiple locations and providing periodic updates to technical leaders in R&D.


Responsibilities include, but not limited to:


  • Provide thermal & mechanical stress simulations to support semiconductor memory process development, pathfinding efforts, and technology development
  • Guide test vehicle development to characterize the material stress and improve simulation correlation to experimental data
  • Develop predictive finite element models of many different structures on silicon wafer (both global and local) including memory arrays, peripheral circuits, and related areas
  • Drive the stress-mitigation design from die layout, material selection, and process flow optimization


Minimum Qualifications:


  • M.S. or Ph.D. in Mechanical Engineering, Materials Engineering or related discipline
  • Solid knowledge through academic coursework and work experience in thermal & mechanical multi-physics modeling (linear and non-linear, static and dynamic analysis) and characterization methods (non-linear deformation, viscous behavior, etc.)
  • A deep understand of thermal & mechanical stress physics and familiarity with commercial FEM tools such as ANSYS, Sentaurus Interconnect, COMSOL, ABAQUS. Prior hand-on experience in the above tool(s) is preferred
  • Ability to effectively work in a multi-functional team environment and collaborate with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new memory technology development
  • Strong verbal and written communication skills is a necessity, and required to be an effective collaborator and creative problem solver
  • Experience in semiconductor fabrication flows and knowledge of state-of-the-art memory technologies (specifically for 3D-NAND and DRAM) are preferred


About Us


As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.


Micron Benefits


Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-SC2 ||

Nearest Major Market: Boise
Nearest Secondary Market: Meridian

Job Segment: Semiconductor, Engineer, Manufacturing Engineer, Thermal Engineering, Fabrication, Science, Engineering, Manufacturing