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Process Engineer

Boise, ID, US


Req. ID: 198521 


Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Thin Film Process Development Engineer at Micron Technology, Inc., you will contribute at a high level as part of process technology team to develop deep sub-micron generation production-worthy and low-cost processes. You will provide ownership for both process development & related tool issues for specific films/processes. You will also be responsible for incorporating these processes into corresponding process flow for application in high density sophisticated memory parts, primarily 3D NAND applications.


Responsibilities include, but not limited to:

  • A minimum of 3 years of experience or equivalence in thin films research and development, preferably with experience in deposition for microelectronic devices
  • You will work with a wide variety of people in multiple fields within the R&D process, integration, pilot line, and high-volume production to effectively accomplish tasks in a timely manner
  • Plan and execute effective, well-designed experiments and write clear concise reports detailing the results
  • You will Recognize, suggest process alternatives, and evaluate different options that may provide improved film properties and higher process margins
  • Provide and take constructive feedback from other team members and demonstrate recommendations to drive projects forward
  • You will develop new chemistries and hardware for process innovation
  • You will define process and equipment strategies for next generation NAND
  • Design and execute quality experiments to improve NAND Cell performance
  • Identify and understand failure mechanisms of Cell materials and correlate with NAND Cell electrical behaviors
  • Deliver innovative solutions to enable next generation 3D NAND Cell technology
  • Drive collaboration with integration, device and manufacturing teams to address NAND Cell technology gaps
  • You will initiate and drive project status updates and documentation


Minimum Qualifications:

PhD in Materials Science and Engineering, Chemical Engineering, Physics, Chemistry, Electrical Engineering or similar field. Extensive process development experience may substitute for Ph.D.


An understanding of:

  • Deep knowledge of thin film processing (ALD, CVD) and characterization methods
  • Chemical kinetics, thermal dynamics, plasma physics and chemistry, vacuum physics, and their direct application to thin film deposition processes
  • Electronic material properties resulting from various types of deposited thin films.
  • Deep understanding of fundamental characterization of Cell materials and develop new methodologies that can project NAND Cell reliability
  • Deep understanding of the interactions between process/hardware and device performance
  • Thin films fundamentals and roles in all processing steps of forming memory devices, peripheral devices and their IC circuit
  • Fundamental challenges in material exploration for device scaling
  • Various thin film electrical evaluation methods and techniques such as leakage, impedance, capacitance
  • Micro- and/or nano-mechanical structures and thin film linear and non-linear mechanical behaviors and modeling
  • Experience and knowledge of Fab metrology tools such as optical/electrical methods
  • You are a self-starter and adaptable to Micron's changing needs including working extended hours if required
  • Highly motivated and results oriented, open to learning new skills
  • Problem solving skills both as part of a team and individually
  • Strong communication skills both verbal and written
  • Dependability and takes the initiative to take responsibility for the development of a process and tool


About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is redefining how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and improve communication around the world.


Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || NVE (Non-Volatile Engineering Group) || Experienced || Regular || Engineering || #LI-BG1 || Tier 4 || 

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