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Probe Integration Engineer

Boise, ID, US


Req. ID: 199686 


As a Probe Integration Engineer at Micron Technology, Inc. within Test Solutions Engineering Department Key Equipment Group (KEG); you will have responsibilities for developing, deploying, and supporting Wafer Probe Equipment and Processes used in our manufacturing global locations.  The successful candidate will spend the majority of their time working on company-wide initiatives promoting greater quality, efficiency, and standardization of Probe operations together with enabling Probe roadmap technologies.  A typical day in this position allows candidates to be creative and innovative in the deployment of first-of-a-kind solutions that solve complex problems.   

Responsibilities and Tasks:

Responsibilities for this role will include, but are not limited to, the following:

  • Deploy first-of-a-kind equipment and process capabilities through evaluations of Wafer Probers, Testers & Probe Cards
  • Collaborate with global teams to establish and implement best-known method probe processes globally.
  • Engage equipment suppliers & vendors to address issues of quality, performance, and change management.
  • Establish manufacturing metrics to drive continuous improvement of equipment performance and processes.
  • Develop and deploy new methods or processes as necessary to resolve manufacturing issues.
  • Generate equipment specifications to meet safety and capability requirements of global manufacturing environments.
  • Support the development and integration of first-of-a-kind equipment and processes for high volume manufacturing.
  • Perform statistical analysis of manufacturing data to ensure that processes meet required quality standards.
  • Effectively prepare and present information to manufacturing teams and Engineering Managers.
  • Maintain a strong collaborative relationship with peer groups in other functional areas including Manufacturing, Test Engineering, Process Engineering, and Quality Assurance.
  • Initiate and chair meetings with global manufacturing sites in support of your objectives.
  • Travel domestically and internationally as required.



Successful candidates for this position will have:

  • Excellent grasp of mechanical and electrical engineering fundamentals.
  • Proficiency in thermal systems, machine design, electro-mechanical controls and components, electrical circuits, materials selection, and mechanical stress analysis.
  • Proficiency in statistics, data analysis, and design of experiments.
  • High degree of self-initiative with an ability to think independently.
  • Track record of delivering accurate on-time results.
  • The ability to manage multiple tasks concurrently and see them to conclusion based on a given timeline.
  • Excellent verbal and written communication and presentation skills.
  • Proficiency in project management.
  • Basic knowledge of 3D CAD software.
  • Ability to read and interpret electrical and mechanical build schematics.
  • Strong working knowledge of MS Office products.
  • Ability to work well with others in cross functional initiatives and drive for results.
  • Flexibility to accommodate off-shift meetings in other time zones.


Preferred Experience:

  • Working knowledge of semiconductor processes and semiconductor device test methodology
  • Working knowledge in Data mining (i.e. JMP) will be an advantage


Required Education:

  • A Bachelor of Science degree in Electrical or Mechanical Engineering.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || Frontend Manufacturing || College || Regular || Engineering || #LI-JA1 || Tier 3 || 

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