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Principal Thin Films Engineer

Boise, ID, US


Req. ID: 247866 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As part of Micron’s Technology Development (TD) organization, you will work in an industry-leading, state of the art semiconductor facility for next generation memory and CMOS technology development. As a Thin Film Process Development Engineer, you will join an existing team of engineers responsible for developing and characterizing novel process solutions for advanced CMOS (Complementary Metal Oxide Semiconductor) technology. You will be responsible for engaging with internal teams including process development, process integration, device and reliability engineering, equipment development, pilot manufacturing as well as external equipment and chemical suppliers to develop and integrate robust equipment and process technologies. Encouraged to work independently and with teams to develop new thin films process solutions and optimize them to meet device requirements.


Responsibilities include, but not limited to:

  • Develop, characterize and optimize thin film processes to meet future technology requirements
  • Identify and strategize key thin film challenges for next generation advanced CMOS and DRAM technologies
  • Understand the interactions between process and hardware and be able to demonstrate this knowledge
  • Plan and execute effective, well-designed experiments and write clear concise detailed reports
  • Evaluate and make insightful inferences from large amounts of various types of data, such as physical and electrical analysis
  • Be an ambitious teammate and be adaptable to Micron’s changing needs
  • Collaborate with a team of world-class technologists in generating patents and intellectual property
  • Apply a high degree of motivation, goal orientation, and possess the ability to focus on solving problems collaboratively with the team and individually


Minimum Qualifications:

  • Industry experience in advanced (<32nm) logic device technologies, with work emphasis on Metal Gate Work Function engineering, High-k deposition and Epitaxial SiGe deposition
  • Working knowledge of advanced CMOS device physics and reliability mechanisms
  • Excellent understanding of materials engineering and science fundamentals
  • In-depth knowledge of at least one discipline- chemical engineering, chemistry, or material science
  • Excellent communication and teamwork skills and a strong attention to detail
  • In depth knowledge of chemical reaction engineering, thermodynamics, heat and mass transfer, plasma science and their direct application to thin film processes in various deposition and treatment methods
  • Expertise in thin film processes and tool variables affecting the physical, chemical and electrical properties of deposited films
  • Experience in a variety of thin film deposition techniques, particularly ALD, PECVD, PE-ALD and LPCVD
  • Experience with and understanding of surface analysis techniques like XPS, AFM, XRD, AES, EBSD, SIMS etc.
  • Deep understanding of various thin film electrical evaluation methods and techniques such as leakage, impedance, capacitance
  • Excellent interpersonal, data collection and analysis skill



  • M.S. or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, Chemistry or related discipline is required
  • 7-10 years of hands on experience in development of semiconductor thin film deposition



About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.


Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-JF1 ||

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