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Package Simulation Engineer

Boise, ID, US


Req. ID: 187782 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a FEM simulation engineer at Micron Technology, Inc. the engineer will work in the Advanced Package Technology Development team. In this position, the engineer will be responsible for influencing thermo-mechanical and thermal designs and finding optimal package structure and materials to mitigate any potential issues. Scope of the engineer’s work is to address all thermo-mechanical and thermal aspects of 2.5D and 3D advanced packaging development that is associated with design, material and process interactions. At the same time, the engineer will responsible for thermal characterization to validate the model. Finally, it is the engineer’s main role to predict all potential risks that may occur during working environment and mitigate those risks in advance through FEM simulation and validation. This position will interface with package architecture, fab/package assembly process integration and BU teams.


Responsibilities include, but not limited to:

  • Perform thermo-mechanical and thermal FEM simulation to support package architecture and assembly process
  • Provide material, architecture and assembly/fab process condition recommendations for successful advanced package development
  • Guide test vehicle development to implement optimal test keys for thermo-mechanical and thermal validation and simulation correlation
  • Optimize thermo-mechanical and thermal solution requirements through simulation and characterization 
  • The engineer is expected to work with cross-functional engineering team to provide process and guidance on advanced package development, and review/provide reference thermal solutions to internal customers, as needed
  • Provide FEM simulation and characterization reports to internal customers to support advanced package development and guide innovation for advanced fab/package assembly process and design

 Minimum Qualifications:

  • Working knowledge/experiences in applying Finite Element Modeling (FEM) in related areas; and familiarity with software tools such as ANSYS, COMSOL, FloTHERM, and IcePak
  • A strong background in thermo-mechanical and thermal sciences with emphasis on both analytical and characterization methods
  • Experience on thermal characterization and familiar with JEDEC environment thermal testing
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development
  • Solid knowledge through academic coursework or experience required in thermo-mechanical and thermal modeling
  • Thorough knowledge of material properties and material characterization methods
  • A good understanding of semiconductor packaging/semiconductor device technology and trends such as 2.5D and 3D is helpful
  • Outstanding written and verbal communication skills
  • Proactive and creative approach for problem solving

Degree required:

  • MS but PhD preferred


Academic Discipline(s):

  • Mechanical Engineering, Materials Engineering or related discipline


About Us


As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.


Micron Benefits


Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-KV1 ||

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