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Package Lab Engineer

Boise, ID, US

Req Id: 245944 


Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation,

tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This

means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Package Lab Engineer in the Package Reliability and Qualifications Operations team at Micron Technology Inc., you will be responsible for developing, maintaining, and improving characterization and failure analysis methods for microelectronics packages and PCB assemblies. This responsibility includes specifying and improving processes, selecting equipment, and interpretation of test results with respect to industry standards and Micron requirements. In support of these responsibilities, you will be expected to develop and maintain knowledge of leading-edge technology and will work on projects that advance the leading-edge. Characterization methods include board-level reliability (thermal cycling, shock, drop, etc.), bond integrity testing, solderability,

Moisture sensitivity, and mechanical testing (e.g., bend, torsion).


Successful Candidates for this position will have:




  • Knowledge of DOE methods.
  • Strong analytical problem-solving skills.
  • Ability to work well independently and in teams.
  • Good written and verbal communication skills




  • Knowledge of microelectronics component or module/assembly construction and materials.
  • Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies.
  • Understanding of the effects thermo-mechanical, thermal, mechanical and hygroscopic swelling stresses on IC packages.
  • Knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred.
  • Knowledge of microelectronics failure analysis and characterization methods and industry standards (e.g. JEDEC, IPC)




Required: Master’s degree in mechanical/materials Engineering or a related field of study. 


About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.


Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
Keywords: Boise || Idaho (US-ID) || United States (US) || Backend Manufacturing || College || Regular || Engineering || #LI-RJ1 ||

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