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Intern - Thin Films Process Development Engineer

Boise, ID, US


Req. ID: 232181 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Thin Films Process Development Engineering Intern, you will join the Metals/Implant technology team to develop production-worthy, low cost processes, including PVD, CVD, ALD, beamline implantation, and Plasma Immersion Implantation. You will provide ownership for process development issue for specific films/processes. You will also be responsible in assisting incorporation of these processes into corresponding process flow for application in high density NAND and advanced memory parts.



In this role we are looking for the following skills and experience:

  • Completed Courses and Lab work in fundamentals of electrical, physical, chemical and mechanical material properties, preferably in growth and characterization of electronic materials and thin films
  • Understanding of thermal dynamics, chemical kinetics and their direct application to PVD, CVD, and ALD deposition processes. Understanding of fundamental plasma processing and its impact on film properties.
  • Ability to apply the fundamental learning, basic principles, theories, and concepts in problem solving with mentorship
  • Ability to work positively with a wide variety of people in different areas of R&D process to effectively accomplish tasks in a timely manner and interact and collaborate with device integration engineers to develop robust film and related module
  • Ability to plan and execute effective, well-designed experiments and write clear, concise reports documenting the results with the motivation of "who needs to know these results?"
  • Understanding of the interactions between process and hardware and then apply this knowledge as needed. Identify and evaluate interactions between equipment, modules and processes and resolve related issues. Provide suggested solutions to equipment or process problems. Tackle straightforward problems, with supervision, to identify such things as root cause of equipment and/or parameter shifts
  • Ability to give and take constructive criticism from other team members and be able to use feedback to drive projects forward with one question in mind, "how can this be done better?"
  • Experience and knowledge of Fab metrology tools are plus, such as optical/electrical methods (Rs, thickness, reflectivity, optical constants, stress, and micro-mass measurement, etc.)
  • Understanding of different types of physical film analysis techniques such as SIMS, XPS, EDS, SEM, TEM/EELS, RBS, ICP-GDMS, SRP, XRR, and XRD. Understanding of various thin film electrical evaluation methods and techniques are plus
  • Ability to evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis. Demonstrate sound data analysis and discernment. Present reports and findings with appropriate conclusions and recommendations


In addition, we expect applicants to be highly motivated, daring and possess the ability to passionately focus on solving problems on a team or individually. Strong communication, computer skills, and presentation skills are advantageous. Capable of managing projects effectively while making the best use of available resources. Applicants are expected to be meticulous and willing to take responsibility for the development of a process and tool. Capable of learning new skills as needed.



Either in pursuit of a Ph.D., or in a B.S. or M.S. program with the intent to pursue a Ph.D. in Chemical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering or similar field. Candidates must have continued coursework following completion of their internship (graduation date should not be prior to December 2021.)


About Us


As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands - Micron, Crucial and Ballistix - we offer the industry's broadest portfolio. We are the only company manufacturing today's major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific break throughs and enhance communication around the world.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Intern || Internship || Engineering || Not Applicable ||

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