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Intern - Thin Film Process Development Engineer

Boise, ID, US

 

Req. ID: 230065 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

 

As a Thin Film Intern Process Development Engineer, you will contribute at a level as part of Metals/Implant technology team to develop production-worthy, low cost processes, including PVD, CVD, ALD, beamline implantation, and Plasma Immersion Implantation.  You will provide ownership for process development issue for specific films/processes.  You will also be responsible in assisting incorporation of these processes into corresponding process flow for application in high density DRAM/NAND and advanced memory parts.

 

Qualifications:

Successful candidates for this position will have the following skills and experience: 

 

  • Completed Courses and Lab work in fundamentals of electrical, physical, chemical and mechanical material properties, preferably in growth and characterization of electronic materials and thin films. Understanding of thermal dynamics, chemical kinetics and their direct application to PVD, CVD, and ALD deposition processes. Understanding of fundamental plasma processing and its impact on film properties.
  • Ability to apply the fundamental learning, basic principles, theories, and concepts in problem solving with supervisor guidance.
  • Ability to work positively with a wide variety of people in different areas of R&D process to effectively accomplish tasks in a timely manner.
  • Ability to plan and execute effective, well-designed experiments and write clear, concise reports documenting the results.
  • Understanding of the interactions between process and hardware and be able to leverage this knowledge. Identify and evaluate interactions between equipment, modules and processes and resolve related issues. Provide suggested solutions to equipment or process problems. Solve straightforward problems with guidance, as needed, to identify such things as root cause of equipment and/or parameter shifts.
  • Ability to give and take constructive criticism from other team members and be able to leverage input to drive projects forward.
  • Experience and knowledge of Fab metrology tools are plus, such as optical/electrical methods (Rs, thickness, reflectivity, optical constants, stress, and micro-mass measurement, etc.).
  • Understanding of various types of physical film analysis techniques such as SIMS, XPS, EDS, SEM, TEM/EELS, RBS, ICP-GDMS, SRP, XRR, and XRD.
  • Understanding of various thin film electrical evaluation methods and techniques are plus.
  • Ability to evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions and recommendations.
  • Ability to interact and collaborate with device integration engineers to develop robust film and related module

 

In addition, candidates for this position should be highly motivated, goal oriented and possess the ability to aggressively focus on solving problems both as part of a team and individually.  Excellent verbal and written communication skills are required to be effective.  Must be able to manage projects effectively making best use of available resources.  Must be dependable and willing to take responsibility for the development of a process and tool.  Must be able to learn new skills as needed.

 

Education:

Ph.D. candidates, B.S. and M.S. candidates who are intended to pursuit Ph.D. in Chemical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering or similar field. Graduation date should not be prior to September 2021.

 

About Us

 

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands - Micron, Crucial and Ballistix - we offer the industry's broadest portfolio. We are the only company manufacturing today's major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific break throughs and enhance communication around the world.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Intern || Internship || Engineering || Not Applicable ||
 

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