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FEM Simulation and Data Modeling Engineer - Advanced Packaging Technology Development

Boise, ID, US

 

Req. ID: 181923 

 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

 

As a package simulation and data modeling engineer at Micron Technology, Inc. you will work in the Advanced Package Technology Development (APTD) team. This position is responsible for influencing mechanical and thermo mechanical designs and finding optimal fab/package assembly process conditions and materials to mitigate any potential issues. Your scope of work is to address all mechanical and thermo mechanical aspects of 2.5D and 3D advanced packaging technology that are associated with material and process interactions. You also model data and perform predictive and regression analysis. Finally, your main role is to predict all potential risks that may occur during fab/package assembly process and proactively mitigate those risks. This position will work with package architecture, fab/package assembly process integration and data analysis teams.

 

Responsibilities include, but not limited to:

  • Perform thermo-mechanical and mechanical FEM simulation to support package assembly and fab process
  • Perform high level multi physics simulation to predict phase transformation and chemical reaction during package assembly process and reliability test
  • Analyze thermo-mechanical and mechanical architecture of advanced package with strong FEM simulation background
  • Provide material, structure and assembly/fab process condition recommendations for successful advanced package development
  • Data analysis using pivot tables and perform predictive and regression analysis
  • Data modeling using various data modeling tools and scripting using Python, Matlab and/or equivalent software
  • Solve complex problem using high level of mathematical ability, methodical and logical approach with accuracy and attention to detail
  • Manage multiple data analysis projects and effectively influence and communicate with internal customers
  • Analyze, model and interpret data for advanced package development
  • Provide FEM simulation and data modeling reports to internal customers to support advanced package development and guide innovation for advanced fab and package assembly process

 

Minimum Qualifications:

  • MS (PhD preferred) in Mechanical Engineering, Computational Modeling and Simulation Engineering, Materials Engineering or related subject area
  • Solid knowledge in FEM simulation and programming
  • Hands on experience of major FEM tools (ANSYS, COMSOL and/or equivalent FEM software)
  • Proficient in Matlab, Python, C++ and/or equivalent software
  • Programming FEM software and numerical tools to set up automated model generation user interface and maintain those codes
  • Understanding of fab/package assembly process and apply relevant data retrieval techniques and/or machine learning algorithms and propose data analytic approach to improve product quality and process efficiency
  • Deep understanding of packaging/semiconductor device structures, processes and reliability
  • Solid knowledge through academic coursework or experience required in thermo mechanical, mechanical and multi-physics modeling
  • Thorough knowledge of material properties and material property test methods (non-linear deformation, viscous behavior, etc)
  • A good understanding of semiconductor packaging/semiconductor device technology and trends such as 2.5D and 3D is helpful
  • Outstanding written and verbal communication skills
  • Ability to work in a team environment and collaborate with other specialists to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development
  • Proactive and creative approach for problem solving

 

About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information! Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

 

Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center/Activity rooms (Boise/San Jose only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || College || Regular || Engineering || #LI-KD1 || Tier 4 || 

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