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Device Engineer

Boise, ID, US


Req. ID: 218403 


Device Engineer


Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Device Engineer working in the R&D Emerging Memory Technology Group at Micron, you will be working in an industry-leading 300mm R&D facility on technology that enables future memory scaling. You will focus on Device characterization of memories such as PCM, RRAM, STT, Nanotube, 3D, Crosspoint, FBC, etc., both for non-volatile and volatile memories. You will be responsible for the characterization and data analysis of new memory, analyzing electrical failures, improvement of yield and overall cell performance. In addition to a broad basis of Device knowledge, you have a deep understanding of Semiconductor Device Physics, including CMOS, bipolar, diodes, etc. You interact significantly with material, process, design, modeling, characterization, and product groups.


Responsibilities include, but not limited to:

- Develop an understanding of process and device requirements for new memory cell and selectors and help refine requirements, as necessary.

- Characterize array and model cell device properties to identify improvement opportunities (product bias setting, process integration, design waveform, etc).

- Contribute to the cell material and process flow definition, particularly in the area of device physics and array analysis.

- Contribute to the definition and validation of the cell electrical specifications for product qualification.

- Understand and develop models for fundamental yield-limiting mechanisms in new memory technologies through statistical data analysis of experiments conducted in Semiconductor FAB.

- Evaluate in-line, probe, parametric, and back end data.

 - Correlate array reliability and characterization testing to product reliability.    

- Define, support, and gather data on media management techniques, on-chip, and in-system to improve performance and reliability of end product.

- Provide project status updates to the team and management at a regular cadence.

- Collaborate effectively with cross-functional teams, including product, modeling, design & process integration engineers, to address cell deficiencies and execute improvement roadmaps.


For this position, it is essential that you have excellent problem-solving and analytical skills as well as good communication, organizational, and team-building skills. The ability to work in teams and to work well with others and to be a self-starter with a strong work ethic is also critical for this job.

As an integral part of R&D, you will engage with numerous multi-functional teams, including Process Development, Product Engineering, Design, Yield Enhancement, Advanced Mask, Probe, etc. to arrive at solutions to yield and margin issues.



·        You have a thorough knowledge of mainstream memory technologies such as DRAM, NAND, NOR, & SRAM acquired through significant industry experience.

·        Expertise in device physics.

·        You understand the challenges and opportunities facing alternative memory technologies is expected.

·        You are very familiar with both Process Integration & Circuit/Architecture issues as they relate to memory.

·        You are proficient with data analysis, DOE, and statistical techniques.

·        You can demonstrate success in a multi-tasking team environment which requires excellent communication, organizational, and team-building skills.



·        MS or Ph.D. in Electrical Engineering, Physics, or other related technical field is required.


About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.


Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-GC1 || Tier 5 || 

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