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Atomic Layer Etch (ALE) Process Technologist

Boise, ID, US

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 


Req. ID: 231802 


As a Process Engineering Technologist in the Technology Development Engineering (TDE) Group at Micron, you will work in industry-leading semiconductor process technology, applying that technology to delivery world class memory technologies. In this position, you will design, explore and optimize Thermal / Vapor Atomic Layer Etch (ALE) Process Technology for layer by layer removal of complex 3 nano-structures. You will take ideas from conception through process development and implementation. You will be working alongside with Equipment Engineers, Process Development Engineers and Process Integration Engineers to focus and accelerate development of technology that will most likely lead to a commercially successful high-density 3D NAND and DRAM memory.


Responsibilities include, but not limited to:

  • Develop processes for etching complex stack of materials.
  • Collaborate in cross-functional teams inventing and evaluating innovative solutions to plasma etch novel films and patterning schemes, enabling new device structures.
  • Design, optimize and characterize plasma etch and/or vapor etch processes to meet functional, project objectives.
  • Organize well designed experiments to understand the interaction between process and hardware and use this knowledge to meet functional, project objectives.
  • Actively manage your projects – develop plans, track performance to plan, resources required.
  • Actively participate in all activities, lead without authority.
  • Act in all ways with integrity and customer focus. Do not be shy about calling out if/when a project is behind.
  • Serve and lead cross-functional teams to advance Micron’s thermal/vapor process technology portfolio into manufacturing.


Minimum Qualifications:

  • PhD/MS + 5 years’ experience or BS + 8 years’ experience in thermal or vapor etch. Physics, Chemistry, Chemical or Materials Engineering, or related field of study is acceptable.
  • Experience in Atomic Layer Etch (ALE)
  • In-depth understanding of plasma physics, plasma etch processes and/or plasma processing equipment.
  • Ability to research and keep abreast of the latest, vapor and thermal etch technologies.
  • Be a critical thinker and at the same time be a great teammate. Handle constructive criticism from other team members and use recommendations to drive projects forward.
  • Understand thin film physical characterization techniques such as SEM, TEM etc.
  • Possess a high degree of self-motivation, goal orientation and the ability to aggressively focus on solving problems and to learn new skills.
  • Ability to plan and execute well-designed experiments and report results in clear concise reports.
  • Demonstrate dependability and willingness to take on responsibilities.
  • Expertise in new process/tool technology assessment.
  • Ability to work on multiple projects and work through cross-disciplinary and cross-organizational logistical issues.
  • Strong written and verbal communication and reporting skills.
  • Proactive approach to problem/project management and good problem-solving skills.
  • Strong leadership and teamwork skills.
  • Strong knowledge in one or more of the following areas: Transport phenomena, Plasma, Atomic/Molecular Physics, Surface Chemistry, Reaction Engineering.


About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.


Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || College || Regular || Engineering || #LI-JF1 || Tier 5 || 

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