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Principal\SR ASIC Package Design Engineer

Boise, ID, US


Req. ID: 152342 


Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

ASIC Package Design Engineer

Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to collaborate with a team of industry experts to create products that impact billions of people? We are looking for a talented Semiconductor Packaging Master Designer to join our global team.


As a principal ASIC package designer at Micron Technology, Inc., you will be responsible for the enablement of complex flip-chip package layouts that meet outstanding technical standards, including electrical, mechanical and thermal performance. In this highly visible role, you will own and drive advanced package design and development for advanced flip-chip packages. You will have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out.


This position can sit in San Jose, CA or Boise, Idaho. 


  • Design Focus will be primarily on flip-chip packages and heterogeneous integration chip package design.
  • Setup the design, create complex routing standards and design rules
  • Implement package route to meet the rules required for very high-speed serdes and large pin count devices.
  • The role will require interaction with physical design teams, foundry suppliers and a variety of other partners.
  • The capability of understanding and driving to achievements to make development successful. Managing and tracking the number of iterations with PCB, connector, and ASIC team will be required.
  • Complete knowledge of packaging materials and material properties is plus. The knowledge of 2.1D, 2.5D and interposer integration is desired

Build Package Designs

  • Execute advanced package design reviews in a timely and efficient manner
  • Support die padslog layout/optimization
  • Design for optimum electrical performance, manufacturability, and package reliability
  • Perform direct design reviews with assembly Subcon design teams
  • Participate in the DFMEA (Design for Manufacturing) process

Generate Documentation

  • Maintain familiarity with documentation workflows and signoff flows
  • Ensure accurate and timely update of all documents into the Assembly Database
  • Check and proofread designs from different areas (interposer suppliers, sub cons drawings, tooling vendors, etc.
  • Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, etc.


  • Minimum 10+ years of hands-on experience with Cadence APD/SIP or equivalent mentor tools is a must
  • 5 + years’ experience in packaging area with flip-chip design
  • Design, Route, model and validate silicon package substrate designs critical to high-speed networking product requirements. It is critical to understand manufacturing design rules, Signal Integrity and Power Integrity requirements to minimize package iterations and build working designs.
  • Creation and Management of Schematic and Netlist using appropriate tools highly desired
  • Ability to travel internationally as required

About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3DXPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

Micron is an equal opportunity employer and values diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-MW1 || Tier 5 || 

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Nearest Major Market: Boise
Nearest Secondary Market: Meridian

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