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ASIC Package Design Manager - Boise

Boise, ID, US

Micron’s vision is to transform how the world uses information to enrich life for all.  Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 


Req. ID: 285303 


As an ASIC Package Design Manager within the Global Design, Simulation and Substrate team for Micron Technology, you will help to provide direction for ASIC integration into package designs for advanced semiconductor devices.  You will be working with a cross-functional team across several geographies to guide development of package designs optimized for electrical performance that address high speed interfaces, power integrity, and thermal considerations.  You will need to ensure design activities are completed within the project schedule and that design outputs are within Assembly and vendor capabilities.

Responsibilities include the following, but are not limited to:

Codesign Coordination and Management

  • Collaborate with architects, ASIC design leads and package design leads during early chip development to enable optimization of the ASIC floorplan, interconnection scheme, and package designs to meet system performance requirements.
  • Support feasibility studies for various package options and evaluate designs for manufacturability and reliability.
  • Interact with key Business Unit stakeholders and assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements.
  • Support package technology development, including material selection, process development, DOEs, and related activities.
  • Understand and drive to program milestones to ensure on time development execution.
  • Support packaging IP development.
  • Provide design support for thermal/mechanical/electrical simulation analysis.
  • Support the design group’s continuous improvement efforts.
  • Support global design alignment activities.
  • Contribute to package design rules and system development.
  • Contribute to package roadmaps.
  • Contribute to the Competitive Analysis review process.

Package Designs

  • Support die padslog layout/optimization.
  • Support design of highly integrated packages using advanced BEOL and RDL flows with an emphasis on optimal electrical performance, manufacturability, and reliability. Work with customers requiring Advanced Packaging technology, internal process design teams, OSATs, and other ecosystem partners.
  • Support set up of designs, rules, and routing methodologies for advanced processes developed by the Advanced Packaging Development Center.
  • Support package and DFMEA (Design for Manufacturing) reviews with assembly engineering and subcon teams.
  • Support timely, accurate updates of all assembly documents in database such as package drawings, interposer drawings, and manufacturing drawings.
  • Work alongside assembly engineering to work with PCB suppliers, SMT service companies, OSATs, EMS companies, and other ecosystem partners. Translate their requirements into advanced packaging solutions.

 Contribute to a Safety Compliant Work Environment

  • Identify and promptly report hazards.
  • Follow safety procedures and area work rule.
  • Operate and maintain equipment and tools within manufacturer and company guidelines.
  • Use proper lifting techniques and work in an ergonomically correct manner.


  • PhDEE (preferred) or MSEE with a minimum of 10 years of industry experience within the following areas:
    • Controller and/or Advanced Memory Substrate Design (flip chip / wire bond)
    • PCB Design
    • Signal/Power Integrity Analysis/Optimization
    • Cadence and AutoCAD tools
    • Assembly Process/Materials
    • Assembly DOE definition/management
    • Product Engineering
    • Quality and Reliability
  • Good computer skills and proficient in MS Office
  • CAD experience (Cadence and AutoCAD preferred)
  • Detail orientated
  • Strong oral and written communication skills
  • Ability to interact and work in a team environment
  • Advanced electrical circuit knowledge
  • Ability to read and interpret drawings and schematics
  • Ability to prioritize and manage multiple projects
  • Travel as required


About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.


Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-CM1 || Tier 3 || 

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Nearest Major Market: Boise
Nearest Secondary Market: Meridian

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