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3DxP Senior Product Engineer

Boise, ID, US


Req. ID: 203142 


As a Senior Product Engineer at Micron Technology, Inc., you will be the key interface between the Technology Development, Manufacturing, Marketing, Applications Engineering, and Quality departments. You will be deeply engaged in developing, validating, characterizing, and qualifying Micron’s next generation 3DxP memory products to power our customers’ innovation. You will run Verilog simulations, create and maintain design documentation, and analyze functional test data. You will innovate to resolve design, performance, yield, and reliability issues through simulation, hands-on debug in the lab, and volume data analysis. In addition, you will serve as a resource and subject matter expert for less experienced Product Engineers.


The future of non-volatile memory and the systems that utilize the advanced technology will continue to be exciting and dynamic. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.


Responsibilities and Tasks

  • Prepare for initial tapeout for new 3DxP semiconductor memory products.
  • Coordinate post tapeout validation activities in preparation for initial silicon arrival.
  • Problem-solve, configure, and optimize the product to maximize performance yield, cost, and reliability.
  • Partner with other Engineering, Manufacturing and Marketing groups to develop and ship successful products and end-systems.
  • Provide technical training and expertise.
  • Perform electrical failure analysis (EFA) and solve complex technical problems using both simulation and lab tools and techniques.
  • Find solutions to challenging technical problems, using e.g. Verilog simulation, electrical failure analysis, and high-volume data analysis.
  • Develop Production, Reliability, and Characterization Test Flows on production and engineering platforms utilizing C++ and Python.
  • Provide key contributions to cross-functional teams to solve critical technical problems through the various phases of product development.



  • Good multitasking and organizational skills.
  • Excellent problem solving and analytical skills.
  • Use extensive technical knowledge to guide decisions and strategies for a project.
  • Strong data analysis, Verilog simulation, and hands-on/lab problem solving skills.
  • Ability to lead a cross-functional technical team for issue resolution, including delegating tasks and setting priorities.
  • Ability to communicate highly complex information effectively.
  • Good Project Management skills.
  • Self-motivated and enthusiastic.
  • Strong understanding of mixed-signal circuit operation.
  • Extensive experience with VLSI and semiconductor device physics is required.
  • Familiarity with problem solving methodologies such as 8D and 5Why is preferred.
  • Experience using Cadence layout and schematic tools is preferred.
  • Experience with Non-Volatile memory devices or systems is preferred.
  • Experience with semiconductor fabrication, backend manufacturing processes, and SPC is preferred.
  • Collaborates with customers to advance project needs.
  • Demonstrated ability to partner successfully with cross-functional groups to build strong relationships and achieve the best outcomes for Micron.
  • Effective communication skills in written and spoken English.



Position requires a minimum of a bachelor’s degree in Electrical or Computer Engineering.



The ideal candidate would have 5+ years of relevant experience.


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords:  Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || Experienced || Regular || Engineering || #LI-BG1 || 3DXP / NAND DE || 

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