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3DXP Product Reliability Engineer

Boise, ID, US

 

Req. ID: 202871 

 

 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

 

We would like you to join our team! As a 3DXP Reliability Engineer in the Product Engineering team at

Micron, you will work with an industry leading team on groundbreaking technologies that will help transform the memory industry!

 

Your primary responsibility will be development and analysis of the both wafer (WLR) and unit (ULR) level reliability characterization flows on our latest designs to support our component spec and product roadmap. This will include but not be limited to: reliability failure mode model development, definition of new characterization methods that capture reliability mechanisms, test flow details, bench correlation, and statistics for data analysis. In this key position you will be encouraged to work with adjacent engineering teams (Design, Process Integration, Cell Development, Probe, Test and QRA engineering) across sites to improve learning and drive technology and product development.

 

A successful candidate for this position will have:

  • Knowledge of mainstream semiconductor memory technologies such as DRAM, NAND, NOR, and PCM
  • Experience with alternative / emerging memory technologies (preferred)
  • Proficiency with electrical device data collection and analysis, DOE, and statistical techniques
  • Experience with statistical data analysis in JMP, R or Excel
  • Experience with programming/scripting languages
  • Excellent analytical problem solving skills.
  • Strong written and verbal communication skills
  • Experience working in global, multi-functional teams
  • Ability to build and manage relationships

 

Education

M.S. or PhD. degree in Electrical Engineering, Materials Engineering, Chemical Engineering, or Physics

 

About Us

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and improve communication around the world.

 

Micron Benefits

Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

 

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form


Keywords:  Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || Experienced || Regular || Engineering || #LI-BG1 || Tier 4 || 

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