Share this Job

3DXP Senior Product Engineer

Apply now »

Date: Jan 12, 2019

Location: Boise, ID, US

Company: Micron

 

Req. ID: 123187 

As a Senior 3D Cross Point Product Engineer at Micron Technology, Inc., you will be the key interface between the Technology Development, Manufacturing, Marketing, Applications Engineering, and Quality departments. You will be deeply engaged in developing, validating, characterizing, and qualifying Micron’s next generation 3DxP memory products to power our customers’ innovation. You will run Verilog simulations, create and maintain design documentation, and analyze functional test data. You will innovate to resolve design, performance, yield, and reliability issues through simulation, hands-on debug in the lab, and volume data analysis. In addition, you will serve as a resource and subject matter expert for less experienced Product Engineers.

The future of non-volatile memory and the systems that utilize the advanced technology will continue to be exciting and dynamic. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities and Tasks

  • Prepare for initial tapeout for new 3DxP semiconductor memory products.
  • Coordinate post tapeout validation activities in preparation for initial silicon arrival.
  • Problem-solve, configure, and optimize the product to maximize performance yield, cost, and reliability.
  • Partner with other Engineering, Manufacturing and Marketing groups to develop and ship successful products and end-systems.
  • Provide technical training and expertise.
  • Perform electrical failure analysis (EFA) and solve complex technical problems using both simulation and lab tools and techniques.
  • Find solutions to challenging technical problems, using e.g. Verilog simulation, electrical failure analysis, and high volume data analysis.
  • Develop Production, Reliability, and Characterization Test Flows on production and engineering platforms utilizing C++ and Python.
  • Provide key contributions to cross-functional teams to solve critical technical problems through the various phases of product development.

 

Skills

  • Good multitasking and organizational skills.
  • Excellent problem solving and analytical skills.
  • Use extensive technical knowledge to guide decisions and strategies for a project.
  • Strong data analysis, Verilog simulation, and hands-on/lab problem solving skills.
  • Ability to lead a cross-functional technical team for issue resolution, including delegating tasks and setting priorities.
  • Ability to communicate highly complex information effectively.
  • Good Project Management skills.
  • Self-motivated and enthusiastic.
  • Strong understanding of mixed-signal circuit operation.
  • Extensive experience with VLSI and semiconductor device physics is required.
  • Familiarity with problem solving methodologies such as 8D and 5Why is preferred.
  • Experience using Cadence layout and schematic tools is preferred.
  • Experience with Non-Volatile memory devices or systems is preferred.
  • Experience with semiconductor fabrication, backend manufacturing processes, and SPC is preferred.
  • Collaborates with customers to advance project needs.
  • Demonstrated ability to partner successfully with cross-functional groups to build strong relationships and achieve the best outcomes for Micron.
  • Effective communication skills in written and spoken English.

 

Education

Position requires a minimum of a Bachelor's degree in Electrical or Computer Engineering.

 

Experience

The ideal candidate would have 5+ years of relevant experience.

 


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || College || Regular || Engineering || Not Applicable ||
 


Nearest Major Market: Boise
Nearest Secondary Market: Meridian

Job Segment: Semiconductor, Engineer, Manufacturing Engineer, Product Development, Electrical, Science, Engineering, Research